Dedicated to my family and to my employer Elma Bustronic Inc, who collectively make it possible for me to continue to develop this growing document.

Copyright (c) 2010 michael munroe
Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.  A copy of the license is included in the section entitled "GNU Free Documentation License".
The most up-to-date version of this document can always be accessed at:
http://groups.yahoo.com/group/StandardsMM/
Air Force IEEE Serial Rapid IO
ANSI I2C Bus SFF
ARINC INCITS Storage Bridge Bay
ASI-SIG IPC Telecordia
ASTM
ISO TIA
ATIS T1 JEDEC UL
DOD Directives LXI UXPi
ECMA MILITARY STDS VECI

OBSAI
StatEye
EIA a.k.a. RS
OIF VITA
ETSI
PCI SIG
VRCI
GEIA PICMG
VXI Systems Alliance
HSBI PXI Systems Alliance RTCA
IBM Blade Server RSC US Navy
IEC SCOPE EPIC Express

SGMII
SPACE 104
CC-Link
XAUI
PC/104

SERIAL ATA
USB Implementers Forum

GNU Free Documentation License Revision History

 created by michael munroe

Draft Date

Editor

Title        updated 7 January 2010

Guide to color code used in the table below.

Standards Organizations and their web sites with documents listed.

  


Clickable “bookmarks” above for each organization.
Use your browser’s “find on page”"CTL F" to find a document by name.

Light gray

 

 

Indicates an abandoned effort

Other colors

 

 

Indicates a related group of documents under active development

 White (no color)

 

 

 Indicates a released document

PCI Industrial Computer Manufacturers Group

 

 

http://www.picmg.org  

PICMG 1.0 R2.0

10/10/1994
released

D. Somes 

PCI-ISA Card Edge Connector for Single Board
Computers.  The cover is identified as "Revision 2" This  early specification does not have a document number. This document is 16 pages long.
PICMG 1.0 R3 draft ECR
abandoned

ECR topics for R3.0 -001 PCI Local Bus 2.2 Update,  -002 PCI Local bus Extensions, -003 SBC Mechanicals, - 005 Interrupt bindings, -006 SMbus.

PICMG 1.1 R1.02

8/1/1995
released

 

PCI-PCI Bridge Board Connector for Single Board Computer. This document is listed on the PICMG website as R1.1 and dated 5/25/1995. However, the actual document cover page of the document reads "Revision Number 1.02" and "Revision date August 01, 1995.  The document is 21 pages long.

PICMG 1.2 R1.0

released
1/23/2002


PCI This document defines the mechanical and electrical architecture of a system with either two PCI/PCI-X busses or a single PCI/PCI-X bus. This document is 34 pages long.

PICMG 1.3 R1.0

7/12/2005
 released

J. Munch

SHB Express System Host Board PCI Express
Specification – This is a BTX form factor with the standard PCI Express  edge card connectors. A SHB host board and backplane are defined. Two modules sizes:  full and half size. 8X 2.5 GBps  16X=5.0 GBps initial is parallel PCI Express pins reserved for serial PCI Express (advanced switching). This document is 48 pages long.

PICMG 2.0 R3.0 ECR PCI-X D0.6a

released 11/16/01


This ECR was incorporated in subsequent
 printings of PICMG 2.0 R3.0

PICMG 2.0 R3.0 ECN2.-3.0-00- 002

released 1/23/2002   

 

Compact PCI Core Specification, with self
describing slot geometry and PCI-X rules. First released
1 October 95 ECNs released  1/23/2002

PICMG 2.1 R2.0

released  1/17/2001

 

CompactPCI Hot Swap

PICMG 2.2 R1.0
PICMG 2.3 R1.0
PICMG 2.4 R1.0

released  9/9/1998

 

VME64x on CompactPCI
PMC on CompactPCI
IP on CompactPCI 

PICMG 2.5 R1.0

released   4/3/1998

 

CompactPCI Computer Telephony 

PICMG 2.6 D0.4

1/12/2001

abandoned

S. Mercer  B. Robitaille

Bridging Beyond 8 Slots: Common Practices –
This important standard is lost in place –
the editor and chair stopped work.  No further activity
anticipated.

PICMG 2.7 R1.0

released  4/10/2001

 

6U CompactPCI Dual System Slot Specification

PICMG 2.8 D0.7?

4/23/2001

abandoned

D. Kelly

Pin Registration for PXI This became the PXI Instrumentation Bus.
This work was abandoned within PICMG but is now supported by the PXI . Carston Puls was the original energy behind that product line.
 (I only have a copy of D0.7) No further activity expected. However,
PICMG EXP0 is expected to rejuvenate related PICMG activity.

PICMG 2.9 R1.0 ECN 001 5/20/02

released   5/20/2002

 

CompactPCI System Management

PICMG 2.9 IPMI Codes

 7/15/2006

 

A list of IPMI management codes was released in xls format.

PICMG 2.10 R1.0

released  10/1/1999

 

Keying of CompactPCI Boards and Backplanes

PICMG 2.11 R1.0

released  10/1/1999

 

CompactPCI Power Interface

PICMG 2.12 R2.0

released  5/20/2002

 

Hot Swap Infrastructure Interface

PICMG 2.13 D0.6

11/29/2001
abandoned

G. Graf

Redundant System Slot Specification – This has been inactive long enough to pronounce “dead”

ICMG 2.14 R1.0

released  9/5/2001

 

CompactPCI Multi-computing Specification

PICMG 2.15 R1.0 ECN 2001

released  1/22/2003

 

PCI Telecom Mezzanine/Carrier Card Specification

PICMG 2.16 R1.0

released  9/5/2001

 

CompactPCI Packet Switching Backplane Specification

PICMG 2.17 R1.0

released  5/20/2002

 

CompactPCI StarFabric Specification

PICMG 2.18 R1.0

released 6/18/2004

A. Kaiway

Serial Rapid IO Specification – Over CompactPCI 2.0

PICMG 2.20 R1.0

released  10/21/2002

 

CompactPCI Serial Mesh Backplane Specification

PICMG 2.30 RC1.0

9/23/2009

Manfred Schmitz

CompactPCI Plus IO. This document will cover the implementation of PCI Express signals on the J2 connector of a CompactPCI board. A special shielded 7-row 2mm connector referred to as ultra-hard metric is utilized. This is a connector available from 3M.  This document completed balloting in November of 2009.  The release candidate document is 40 pages long.

PICMG 2.31 d0.31

11/30/2009

Manfred Schmitz

CompactPCI HSF.PICMG 2.31 CPCI-S CompactPCI Serial defines a new 12 row AirMax style connector to create hybrid systems that can be comprised of a CompactPCI Plus System board and up to 7 CompactPCI® peripheral boards as well as up to four CompactPCI®Plus
peripheral boards with limited functionality.  Alternatively,  full mesh systems can be supported utilizing only  CPCI-S boards. The current draft is 96 pages long.

PICMG 2.50x Base Doc. D0.83 draft 9.0 expected soon.

3/6/2005
dormant

C. Hill

CompactTCA on 2mm HM with 3 row ADF in P4 position. This document remains under development but I  am not participating and cannot determine the current draft level.

PICMG 2.50 Power Control V1.0

2/2/2005
dormant

P. Hawkins

CompactTCA Hot Swap and Power Control CompactTCA Management  Sub team. This subsection discusses the special requirements on Managed FRUs for activation  and deactivation in a CompactTCA® system, specifically the state definitions, messaging, and state transition sequences. These requirements deal with CompactTCA® components at the Field Replaceable Unit (FRU) level. These FRUs include CompactTCA® Boards, CompactTCA® Boards containing mezzanines, CompactTCA Power Supplies, and other  FRUs such as intelligent fans and non-intelligent removable fans that are represented by IPM Controllers, and so on.

PICMG CompactPCI Plus

2008

Manfred Schmitz

CompactPCI Plus. This is a  technical working group preparing a new specification.

PICMG 3.0 R1.0

12/30/2002 released
superceeded

J. Munch

AdvancedTCA Base Specification. This comprehensive document has 438 pages divided into 8 chapters and 3 appendices.

PICMG 3.0-1.0 ECR 3.0-1.0-001 

1/12/2004 released
superceeded

J. Kennedy

ECR to Release 1.0 of AdvancedTCA Base Specification. This ECR incorporated a  number of changes including, cooling, power distribution, lever handles and face plates.

PICMG 3.0 R2.0

9/8/2004 released
superceeded

J. Munch

AdvancedTCA Base Specification This release includes a new Advanced Differential Fabric Connector as well as ECR 1.1 472 pages

PICMG 3.0-2.0 ECR 3.0-2.0-001 

4/28/2005
released
superceeded

M Overgaard

ECR to Release 2.0 of AdvancedTCA Base Specification. This ShMC Cross-connects ECR will add dual 10/100BASE-TX links to allow two dedicated Ethernet links to both shelf managers. This would eliminate the Gigabit Ethernet possibility for the base fabric.  This ECR is now being balloted.

PICMG 3.0 R2.0 ECN 002- R1

5/26/2006
 released
superceeded

J. Munch

ECR to Release 2.0 of AdvancedTCA Base Specification. This ECR  will make a  number of corrections to mechanical drawings, better define cooling requirements,  shelf management and add a redundant dual star topology. No changes are anticipated which would make current product obsolete. Many changes have been made to the system management section and additional mechanical reference designs have been incorporated for such items as front panels. The draft document closed on April 29th. The document is now 536 pages long.

PICMG 3.0 R3.0

3/24/2008

J. Munch

AdvancedTCA Base Specification . This Release 3 draft document is now 632 pages long with 8 chapters and 5 appendicies. There are new RTM pcb dimensions as well as a revised IPMI section. Many other changes are incorporated in this document that has added nearly 160 pages since R2.0 and 100 pages since the May 2006 ECN 002. This document is aproximately 656 pages long.

PICMG 3.1 R1.0

1/22/2003 released

 J. Peters

Ethernet/Fiber Channel for AdvancedTCA Systems 

PICMG 3.1r2

1/2010

D. Sandy

Ethernet Protocol Layer for AdvancedTCA. This document is covering the implementation of 10GBase-KX4, 10GBase-KR  and 40GBase-KR4 on AdvancedTCA. 40GBase-KR4 is the subject of IEEE P802.3ba. Simulations are being undertaken to establish the electrical channel requirements for these Ethernet protocols as defined within IEEE 802.3-2008. This draft continues to make steady progress. At present the group is addressing SI issues and continued simulations.

PICMG 3.2 R1.0

1/22/2003 released

 C. Byers

InfiniBand™ for AdvancedTCA Systems 

PICMG 3.3 R1.0

5/21/2003 released

 S. Cristo

StarFabric™/Advanced Switching for AdvancedTCA Systems 

PICMG 3.4 R1.0

5/21/2003 released

T. Fountain

PCIExpress™/Advanced Switching for AdvancedTCA Systems

PICMG 3.5 R1.0

10/17/2005 released

C. Hill

Rapid IO™/Advanced Switching for AdvancedTCA Systems. In this new document add in cards must identify their signaling method before they are allowed to participate. The Rapid IO signaling architecture is available from www.rapidIO.org 

PICMG 3.6 PRS

6/28/2005
dormant

Pierre Planas

Packet Routing Switched Architecture (PRS) Cell switching architecture (PRS) over the dual star and mesh topologies of PICMG 3.0. I do not have any current information on this document.

PICMG 3.8 D0.?

1/2004
discontinued

R. Davidson

Classification of AdvancedTCA Applications

PICMG AdvancedTCA RTM Interface (ARTM) draft 0.

x/2009

 D. Slaton

AdvancedTCA RTM Interface Solution for AMC modules.

PICMG AdvancedTCA Extensions (IRTM) draft 2.4

9/2009

 C. Engels

AdvancedTCA Intelligent Rear Transition Module specification. This draft document is now 37 pages long.

PICMG  XTCA f Physics no draft

9/2009

 R. Larson

AdvancedTCA and MicroTCA Extensions for Physics.

PICMG  XTCA Software

9/2009

 S. Simrock

xTCA Software Architecture Protocols

PICMG XTCA Timing

9/2009

 R. Downing

xTCA Timing and Synchronization. An AdvancedTiming specification TIM.0 Rev 1 draft 0.1 dated 9/15/2009 has been proposed.

PICMG  AdvancedMC.0 R1.0

1/3/2005

released
superceeded

M. Summers

AdvancedMC™ Advanced Mezzanine Card Base Specification. This is a 294 page specification covering all the system management, mechanical  structure, electrical interface requirements for this mezzanine module  system that is hot pluggable. In July 2006, the executive committee proceeded with the AMC trademark by limiting the claimed applications. Release 2 incorporated new clock circuits.

PICMG AdvancedMC.0         ECN001 R.1.0

6/26/2006
obsolete
incorporated in AMC.0 R2


ECR001  is now a released specification. This 60 page document incorporates some 3,362 ECRs and is based on draft 0.9.

PICMG AdvancedMC.0   ECR002  R.1.0

11/15/2006
obsolete
incorporated in AMC.0R2


ECR002 to PICMG AMC.0 CRs resolved  3,362 ECRs listed. This 342 page document is approved .

PICMG AdvancedMC.0  R2.0

11/16/2006
released


PICMG  AdvancedMC .0 is incorporates ECN001 and ECN002 and is  372 pages long.
This new release added new clock circuits among many other improvements to System Management.

PICMG  AMC.1 R1.0

2/22/2005
released

L. Guthrie

AdvancedMC™  (AMC.1)PCI Express  and Advanced Switching on AMC modules

PICMG  AMC.1 R2

10/8/2008
released


AdvancedMC™  (AMC.1) PCI Express  and Advanced Switching on AMC modules Release 2.

PICMG AMC.2  R1.0

3/1/2007

released

 A. Dickman

AdvancedMC™  (AMC) Gigabit Ethernet/10 Gigabit XAUI Ethernet
A subsidiary specification to AMC.0 Gigabit Ethernet on Advanced Mezzanine Card. This AMC.0
 
subsidiary specification will define Gigabit and 10XGigabit Ethernet using XAUI interface and support mapping for at two channels.  This document is 44 pages long.

PICMG AMC .3 R1.0

 8/25/2005
released

L. Lammers

AdvancedMC™  Storage on Advanced Mezzanine Card. This AMC.0 subsidiary specification will define storage interface port usage and support mapping for Serial ATA, Serial Attached SCSI and Fiber Channel. This document is 25 pages long.

PICMG AMC .4 R1.0

7/11/2009
released

J. Montgomery

AdvancedMC™ RapidIO on Advanced Mezzanine Card. This will define lane usage optimized for a RapidIO environment. This document includes implementation guidance for specific configurations

PICMG AMC .Y SOW

10/28/04

t.b.d.

FibreChannel on Advanced Mezzanine Card. This AMC.0 subsidiary specification will define lane usage optimized for a Fiber Channel environment.

PICMG ARTM R1.7

4/2009

 J. Marden

AdvancedTCA AdvancedTCA Rear Transiton Module Base Specification addresses Interface Solution for AMC modules. This document is now 33 pages long.

PICMG 3.300 Revision 1
AdvancedTCA 300 Draft 0.9
      

10/10/2007

discontinued

N. Robinson

ATCA300 describes an 8U x 220 mm  AdvancedTCA format that is compatible with the front load ETSI 300 enclosures.  Adequate clearance is provided for SFP optical module IO and a special recessed front panel allows AMC modules to be accommodated. This document is 194 pages long and includes extensive updates to the Power Inlet Modules,  and other telecom requirements such as hold up time. This document is currently in the executive member ballot process.

PICMG ASI Switching CORE Architecture Specification Rev 1.0

12/2003

ASI SIG

ASI Advanced Switching CORE Architecture  Specification  This is the complete architecturaql specification for Advanced Switching of PCI Express® Based Systems. This 366 page document was developed by the ASI SIG and turned over to PICMG in February of 2007

PICMG ASI Switching Portal Rev 1.0

9/2004

ASI SIG

ASI Advanced Switching Portal Specification  A Standard Interface for Accessing the AS Fabric for PCI Express® Based Systems. This 43 page document was developed by the ASI SIG and turned over to PICMG in February of 2007

PICMG ASI Protocol Interface Number 8 (ASI-PI-8)  R1.0

2/2004

ASI SIG

ASI Advanced Switching Protocol Interface Number 8. This 100 page document was developed by the ASI SIG and turned over to PICMG in February of 2007

PICMG ASI Socket Data Transfer(ASI-STD)  R1.0

2/2004

ASI SIG

ASI Advanced Switching Socket Data Transfer Specification. This 140 page document was developed by the ASI SIG and turned over to PICMG in February of 2007

PICMG ASI Simple Load/Store Specification (ASI-SLS) R1.0

2/2004

ASI SIG

ASI Advanced Switching Simple Load/Store Specification. This 70 page document was developed by the ASI SIG and turned over to PICMG in February of 2007

PICMG ASI Simple Queing Protocol (ASI-SQP) R1.0

2/2004

ASI SIG

ASI Advanced Switching Simple Queing Protocol. This 50 page document was developed by the ASI SIG and turned over to PICMG in February of 2007

PICMG COM .0 xpress Module RC 1.0 Base
ECR 001
ECR002

7/10/2005  released

12/05/2005
12/20/2006

B. Pebly 

Modular system based on 95 x 125 mm stamps. Allows the partition of processor, north bridge, south bridge or even NP based on PCIxpress serial IO A Computer-On-Module, or COM, is a module with all components necessary for a bootable host computer, packaged as a "super" component. A COM requires a "carrier board" to bring out I/O and to power up. COM modules are used to build single board computer solutions.

PICMG COM 0 R2.0 draft 0.96

12/9/2009

J. Munch

COM 0 R2 is a revision of the COM 0 Express specification. The current revised document is 133 pages long.

PICMG COM-X

10/1/2009

Avantech

COM X is intended to be a small form factor legacy free highly integrated computer module supporting all current serial fabrics. The group is just forming and no draft is yet available.

PICMG Express 0.1 draft      

1/ 2004

Became 1.3

PCI Express on PICMG 1.0 

PICMG Express 0.2 draft

1/ 2004

Became 1.3

PCI Express on PICMG 1.2

PICMG EXP.0 R1.0 RC 1.0 


5/22/2005
released

M. Wetzel

CompactPCI Express – This 174  page specification covers  3U and 6U Eurocard  implementation of PCI Express and PCI Express AS
with system configurations defined for supporting legacy CompactPCI slots, pure  Express slots and slots with both legacy and Express  functionality. Both 3U and 6U applications where the lower 3U utilizes a combination of 3-row ZD, 2mm HM and 7 position UPM  connectors and the upper 3U section implemented with  standard P3, P4 and P5 CompactPCI connector and signal provisions. Detailed electrical requirements as well as full mechanical guidance are provided.

PICMG HPM.1 R1.0


7/7/2007
released

B. Rosenkrantz

Hardware Platform Management IPM Controller Firmware Upgrade Specification. AdvancedTCA intelligent FRUs may be complex enough devices to have software that will require an upgrade during the life of the board. However, even the simplest intelligent FRU has an IPM controller and this device has firmware that also may require an upgrade during the life of the product. Such upgrades may be for a number of reasons such as fixing bugs that are discovered. Another reason for an upgrade is to maintain compliance to requirements that may have changed.  This 66 page document addresses the procedure and methods available to accomplish a firmware upgrade to the Intelligent Platform Module (IPM) Controller.  This document is released.

PICMG ICCC - Rev 0.59

1/9/2009

M. Munroe

PICMG Interconnect Channel Characterization  Methodology. This activity will define terminology, provide channel diagrams and catalog various characterization methods and analytical techniques. Data file structures for display and exchange of channel data will be proposed. This group is not developing new methods nor is it deciding which methods are to be used. This is to be a CORE document that will provide content that can be used to update the electrical requirements portion of various PICMG architectural specifications and other similar serial architectures.  This document will be reorganized as soon as the current document has been updated with all changes from the last ballot. The document is now 68 pages long. The document recently lost its draft editor.

PICMG IRTM.0  Rev D2.74

12/31/2009

K. Bross

AdvancedTCA Intelligent Rear Transion Module (IRTM) Base Specification. This document is now 39 pages long.

ICMG  MicroTCA RC 1.0

7/7/2006
released

M. Franko  
J. Durst
C. Byers
S. Jamieson
E. Waltz
R. James 
T.N

Micro Telecom Computing Architecture Base Specification. Granular  passive host system for granular  switched AMC farm. 4U x 19” x 300mm  deep with 8” (200mm/side) Cube. 10-60  watt per AMC , 12V to AMC, life span   999-9999/8 years $500, cost reduced, radial IPMI-aTCA system management,  1-40 Gb/s SERDES backplane bandwidth, star, dual star, mesh, Multiple AMC support, hot swap and plug and play support Three connector designs have now been chosen to cover through hole, SMT  and compression implementations. This document now has a complete list of requirements to aid in the development of compliance documents. The document is now 538 page long. This standard passed executive ballot and was announced on July 7th. It is now being prepared for publication.

PICMG MicroTCA  .1 R1.0

3/19/2009
released

M. Franko  
C. Campbell

The Micro Telecommunications Computing Architecture Rugged Air Cooled Specification . This document covers rugged air cooled applications for MicroTCA.

PICMG MicroTCA  .2

6/19/2007

C. Campbell

Hardened Convection Cooled MicroTCA. The Micro Telecommunications Computing Architecture Hardened Air Cooled MicroTCA. This document will not be worked on until the completion of MicroTCA.3

PICMG MicroTCA  .3 

12/2/2009

M. Palis

Hardened Conduction Cooled MicroTCA. This specification  .3 covers conduction cooled clamshells and is currently planning a series of tests to confirm that the gold finger connectors will continue to perform properly within the clamshell during shock and vibration. Four new temperature classes at the most extreme levels of shock and vibration have been added to VITA 47 to support this document. An integrated draft document is not yet available. The Test Plan 1.1 has been released.

PICMG PSMA

Liaison

D. Somes G. Nanninga

Memorandum of understanding MOU has been executed with the Power Sources Manufacturers Association.

PICMG RES draft sec 1, 2, 7, 8

7/12/2006

K. Sjoblom

The Requirements Engineering Subcommittee (RES) is preparing lists of specific requirements for various PICMG specifications. They are currently addressing PICMG 3.0 and have recently released an updated list of requirements for section 2. Work has been begun on sections 3, 4, 5, 6, 7 and 8. This is a highly detailed effort and will allow compliance documents to be created. A 21 page master Glossary has beeen released dated August 29, 2007 it was compiled from glossaries from the different PICMG documents including AdvancedTCA®, Advanced Mezzanine Card™, MicroTCA™, CompactPCI®, ompactPCI®Express and reconciled differences to compile a glossary with over 350 definitions.

PICMG SAF

liaison

D. Somes H. Turko

Service Availability Forum is a  joint project for the remote management of aTCA with both DMTF and SMTP based management. Force, Motorola, HP, Radisys, Intel, Sun

PICMG  SFP.0 RC 1.0 of R1.0

3/25/2005
released

M. Rush

System Fabric Plane Format  Note that a System Fabric may be  implemented as:  a LAN between blades in a backplane, a LAN that spans multiple backplanes, a private LAN between Rack  Mount Servers that form a system or  any combination of the above. Note that SFP does not aim to be an end user protocol. It exists only within the confines of a Converged Communications System (e.g. Content Processing Router). SFP is a layer that encapsulates many  types of application protocols, such as: Internet Protocol Data grams, TDM/Voice (I-TDM),  ATM (AAL-1, AAL-2, AAL-5), Wireless SDUs / PDUs (small packets for Wireless applications) Etc.

PICMG ICMG  SFP.1 RC1.0 of R1.0

3/25/2005
released

M. Rush

System Fabric Plane Internal TDM

PICMG XMC Extensions

liaison

 

To support the VITA 42.0 XMC sockets on PICMG form factors and connectivity. This activity is close to completion as VITA 42.0  has been approved and released as a trial use standard.

PICMG Requirements Engineering (RES)

2/7/2006

K. Sjoblom

The proposed technical subcommittee will produce a set of organized requirements intended to help facilitate the interoperability of equipment based upon PICMG specifications. This activity will work in conjunction with SCOPE a special interest group made up of TEMs including Alcatel, Ericsson, Motorola, NEC, Nokia and Siemens http://www.scope-alliance.org/index.html  This group now has a formal Statement of Work. Recently an enumeration scheme has been proposed.

PCI SIG

 

 

http://www.pcisig.com/home 

PCI to PCI Bridge

 

 

PCI  Specification

Conventional PCI 2.2



Revision 2.2 defines the PCI hardware environment including protocol, electrical, mechanical and configuration specifications as well as expansion boards. Seventeen ECRs are incorporated including six mechanical ECRs

Conventional PCI 2.3



Revision 2.3 migrates the PCI bus from 5.0 volt signaling to 3.3
volt signaling and supports the 5V and  3.3V keyed system board connectors  but only supports the 3.3V and Universal keyed add-in cards. The 5V keyed add-in card is not supported  in revision 2.3. 

Conventional PCI 3.0

 

 

Revision 3.0 completes the evolutionary migration plan for the
PCI Local Bus Specification, migrating the PCI bus from the original 5.0V signaling to a 3.3V signaling bus. Revision 2.3 began that evolution by removing support for the 5V keyed add-in card, while providing support for both the 5V and 3.3V keyed system board connectors. Revision 3.0 takes the next step of removing support for the 5V keyed system board connector. Revision 3.0 continues support for the 3.3V keyed system board connector, which supports the 3.3V and Universal keyed add-in cards.

PCMCIA

 

 

PCI Card Bus

PCI-X 1.0 Electrical & Mechanical Spec.

9/27/1999 


Revision 1.0 of the PCI-X specification defines PCI-X 66 and PCI-X 133

PCI-X 2.0a Electrical & Mechanical Spec.

2/5/2002

 

Revision 2a Migrates PCI-X 266 and PCI-X 533 while retaining hardware and software compatibility with previous generations of PCI and PCI-X. 

PCI/PCI-X Contact Finish ECN



Connector contact finish specification.

PCIe Base Module Spec 1.0a

7/23/2002


PCI Express formerly 3GIO high-speed serial interconnect specification Revision 1.0a includes both the Base and Card Electromechanical 1.0a specification documents.  PCI Express includes such features as, QoS, power management, native hot-plug, higher bandwidth, error reporting, recovery and correction new form factors. The PCI Express unifies general-purpose I/O and graphics I/O and provides a linearly scaled 16-lane interconnect that supports data transfer rates greater than 8 GB/s.

PCIe CEM Spec 1.1 

 



PCIe Mini CEM Spec 1.1 

 



PCIe  Base PCI Bus Power Management Draft ECN

 

 

April 1, 2005 member review ends

PCI Express Advanced Switching

 

 

Scalable Serial PCI Express Switched Fabric





PXI Systems Alliance

 

 

http://www.pxisa.org  

PXI Specification Rev 1.0

8/20/1997


PXI Specification Extensions for Instrumentation 

PXI Specification Rev 2.0

7/28/2002


PXI Specification Extensions for Instrumentation 

PIXY Hardware Spec. Rev 2.1

2/4/2003


PXI Hardware Specification Extensions for Instrumentation 

PXI-1 Hardware Spec Rev 2.2 Hardware Spec. 

9/22/2004


PXI Hardware Specification Extensions for Instrumentation on 3U Eurocard CompactPCI Express. This is the current revision of the PXI architecture which is implemented on Compact PCI. This is the core document which is 57 pages long.  PXI  is support within PXI Express utilizing a hybrid slot profile.

PXI-1 Rev 2.2 ECN -1 Hardware Spec. 

4/12/2006

 

ECN-1 to PXI Hardware Specification Extensions for Instrumentation on 3U Eurocard CompactPCI Express. This is  a released ECN that is 8 pages long.

PXI-2 Software Spec R.2.1

2/4/2003

 

PXI Software Specification

PXI -3 VISA for PXI Spec R1.0

9/25/2003

 

VISA for PXI Specification

PXI -4 PXI Module Spec. R1.0

9/25/2003

M. Wetzel

PXI Module Specification

PXI-5 Express Hardware Spec. Rev 1.0

8/22/2005

 M. Wetzel

PXI Express Hardware Specification. This is the current base document for PXI Express over over cPCIe. It is based upon PXI and CompactPCI Express (EXP0). PXI Express was witten immediately after the completion of the EXP0 document by many of the same individuals. PXI continues to be supported within PXI Express by the use of hybrid slots. This document is 92 pages long.

PXI-5 Express Hardware Spec. Rev 1.0 ECN-1 Rev 2.0

2/15/2008

 M. Wetzel

PXI Express Hardware Specification Release 1.0  ECN 1 This revision address the lack of  XP8/XJ8 pin assignments which are necessary for 6U implementations. The maximum continuous current is also adjusted for systems with the XP8/XJ8 connector. This released ECN is 6 pages long.

PXI-6 Software Specification

9/1/2005

 

PXI Express Software Specification
PXI Specification Overview
9/12/2000

The PXI Modular Instrumentation Architecture. This 8 page document was released in September of 2000  and therefor does not mention PXI Express.




PC/104 Embedded Consortium


http://www.pc104.org
PC/104 version 2.5
11/2003

A specification for 8 and 16 bit 80X86 based stackable modules based on a 3.6" x 3.8" card size. The stacking connector supports the 104 pin ISA bus by use of 64 pin and 40 pin connectors.
PC/104 Plus version 2.0
11/2003

This specification adds a 4 column x 30 row 2.0 mm grid connector to the PC.104 board to allow the support of 32 bit PCI signals. PC 104 Plus does not support the 64 bit PCI extensions.
EBX version 2.0
3/1/2005

This Embedded Board eXpandable specification enlarges the PC/104 board size to 5.75" x 8.0". This larger size allows the base board to support additional features such as video, Ethernet, power connectors and taller components such as a processor heat sink as well as a full PCMCIA card slot.
EPIC version 2.0
2/27/2006

This Embedded Platform for Industrial Computing specification defines a 4.528" (115 mm) x 6.496" (165 mm) board size which is midway between the EBX board size and the PC/104 plus board size. This size allows the integration of more functions on the base board than PC/104 Plus while still maintaining a relatively small footprint.
EPIC Embedded Platform for Industrial Computing


http://www.epic-express.org
EPIC Express Platform draft 0.8
8/26/2005

This is an extension to the EPIC standard for stackable PCI Express modules. This document was developed by AMPRO, Micro/Sys, Octagon Systems, Versa Logic and Win Systems and is 20 pages long.
NASA Langley SPACE 104



RSC Mezzanine (no document currently available)
5/7/2006
 R. F. Hodson
The Reusable Scaleable Computer module incorporates the PC/104 Plus architecture into a 11.25 mm x 155 mm shielded conduction cooled form factor for use in space applications. There does not seem to be any formal specification that is available to the public however, modules have been built in a collaboration between the University of Queensland, Brisbane and NASA Langley Research Center. For more information contact robert.f.hodson@nasa.gov

VITA/ANSI Standards

 

 

http://www.vita.com     

ANSI VITA 1 - 1994 R2002

5/24/1999

K.Clohessy  R.Alderman       J.Peters  
 F.Hom
J. Black P. Borril W. Fischer C. Mackenna M. Pauker E. Waltz L. Hevle
VME64 – A 287 page specification. Follows IEEE 1014/D1.2 (also IEC 821Bus) which followed the VITA VMEbus Specification Manual Revision C.1 October 1985 which was the beginning of VITA under Lyme Hevle. Kim Cloohessy was the technical chair and Ray Alderman was the executive chair running interference with the IEEE. Frank Hom recreated most of the drawings. John Peters is credited with originating the concept of the 64bit solution. Other contributors to these documents were John Black, Wayne Fischer, Eike Waltz, Mira Pauker, Craig Mackenna and Paul Borril. This standard originated as Motorola’s VERSAbus which was discussed in a 1981 publication. John Black lead the development of VERSAmodule and a European group developed VERSAmoduleE which in October of 1981 became the Eurocard based VMEbus.

ANSI VITA 1.1-1997(R2002)

10/7/1998

W. Fischer

VME64 Extensions – This 88 page specification incorporated the 5 row IEC 61076-4-113) backward compatible backplane connector, shielded front panels, module keying, module grounding and 2eVME signaling.

VITA 1.1a-200X draft 0.0

3/2005

D. Debock

A proposed extension of the VME64 Extensions standard by use of a proposed 7 row DIN for the purpose of introducing a high-speed serial fabric bus. Harting continues to elaborate on its connector concept.

ANSI VITA 1.x D0.1

5/22/1995 abandoned

W. Fischer

VME64 Extensions Test Report on New ETL Devices, New 160 Pin Connectors & 5 VME64 Extension Backplane became VITA 1.5 and 1.1

VITA 1.xx D0.1

8/30/1995

abandoned

W. Fischer

This was a specification for a next generation VME

NCI VITA 1.3-1997(R2003)

6/9/1998

B. Downing

VME64 9U x 400 mm Format 

VITA 1.4 draft 0.5

12/3/1998     abandoned

L. Francz

VME64 Live Insertion Live Insertion System Requirements- became ANSI-VITA 3 became a board only live insertion documents.

ANSI VITA 1.5-2003

6/2003

M. Rush

American Nat. Std.  for 2eSST (VME64)

ANSI VITA 1.6-2000

2000

H. Sherfinsky

Keying for Conduction Cooled VME64x

ANSI VITA 1.7-2003

8/2003

R. Patterson

Increased Current Level for 96 Pin and 160 Pin DIN/IEC Connector Standard

VME320 (not a VITA or ANSI standard) listed here because of its use with VME64x board technology.

4/15/1996

D. Berding   F. Hirsch

Developed and patented by Drew Berding in conjunction with Bustronic Corporation, this effort was supported by VITA in a marketing campaign. VME320 utilizes an ingenious star backplane design, tapered trace construction and special diode terminations to allow the VME architecture to function as an incident wave, point to point system with conventional bus drivers. These techniques described in three patents allow VME transfers at rates up to 320 Mbytes/sec. The backplanes are built under license from Arizona Digital, Inc. or its agent Bustronic, Inc. Later, it was shown how this technique could achieve data transfers up to 533 Mbytes/sec. Later Texas Instruments developed a 2eSST driver technology that is designed to achieve the same performance on conventional backplanes. It should be noted that the VME320 backplane environment may be an even friendlier environment for such drivers. The technology may also have applications for other signaling methods that would benefit from a near perfect propagation path.

ANSI VITA 2.1-199x D0.5

8/22/1997

E. Barsotti 

abandoned     

Requirements For 2eVME & 2eSST-Compatible Drivers, Receivers and Transceivers. This work resulted in the development of the TI-Universal Bus Transceiver. Testing of initial devices was reported on 3/25/2002. Further work was tabled in May of 2002. The task group results were subsequently incorporated into relevant VME documents such as VITA 1.5. 

VITA VME1000

7/16/1998

A. Lenkisch

abandoned

This series of technical reports was a further extension of the earlier VITA 2.1 Task Group investigation... This work appears to have lead to the ETL device development which resulted ultimately in VITA 1.5. A Hybricon report dated 6/14/1999 is the last document related to this effort.

ANSI VITA 3-1995(R2002)

2002

R. McKee

Board Level Live Insertion for VMEbus.  This document represents a methodology or recommended cards in an operating VMEbus system. This document does not detail a point solution; this is left to the implementer. The primary directive practices guide for inserting or extracting VMEbus when defining this methodology was to maintain maximum compatibility with existing off-the-shelf VMEbus boards.

ANSI VITA 4-1995(R2003)

2002

K. Rubin

IP Modules

ANSI VITA 4.1-1996(R2003)

2003

K. Rubin

IP I/O Mapping to VME64x

ANSI VITA 5.1-1999

8/31/1999

B. Blau

RACEway Interlink - This standard defines a high speed circuit switched point to point interconnect for use between VMEbus modules via the P2 connector.

VITA 5.2-200X

5/12/2004

T. Lavely
retired

RACE++ - This standard will document the RACE++ architecture which has become a de facto replacement for RACEway Interlink in the marketplace. 

ANSI VITA 6-1994 (R2002)

2002

L. Francz

SCSA - This standard defines an isochronous backplane bus for telephony applications on the VMEbus P2 connector. 

ANSI VITA 6.1-1996 (R2003)

2003

L. Francz

SCSA Extensions - This standard provides feature extensions to the ANSI/VITA 6 standard. 

ANSI VITA 10-1995 (R2002)

2002

R. Jan

SKYchannel - A packet switched cross bar interconnect that runs on the VMEbus P2 connector

ANSI VITA 12-1997(R2002)

2002 

 

M-Module – Defines a mezzanine module specification for small sized printed circuit boards.

ANSI VITA 13-1995

7/16/1966 

C. Whitby-Strevens 

VMEbus Pin Assignment Standard for ISO/IEC 14575 (IEEE Std. 1355-1995 (H.I.C.)) – Defines a pin assignment for the VMEbus to support the Heterogeneous Interconnect protocol standard defined in IEEE 1355.

ANSI VITA 17-1998

2/11/1999 

J. Jones

Front Panel Data Port. A specification known as FPDP defines a high-speed digital data protocol over an 80 position flat ribbon connector. This data transfer interface is typically implemented over a flat ribbon cable between two boards across their front panels that would otherwise use a fiber optic link. 

ANSI VITA 17.1-2003

6/2003 

R. Taulton    

Serial Front Panel Data Port (FPDP) draft standard defines a serial architecture based on four different types of data frames: Unframed Data, Single Frame Data, Fixed Size Repeating Data, and Dynamic Size Repeating Frame Data. Data rates of 1.0625, 2.125 and 2.5 Giga baud are supported. Two of these data rates correspond to Fibre Channel defined data rates. Note, this activity was incorrectly listed as abandoned in previous versions of this document. 

VITA 17.2 d0.4

9/12/2006

J. LaLone

Serial Front Panel Data Port (SFPDP) Channel Bonded Protocol Draft Standard. This standardization effort has been revived to define a 10 Gigabaud serial file transfer protocol suitable for front panel or backplane applications. This document is now 48 pages long.

VITA 18-1997 canvas ballot Set 1999

1997 

B. McKee      abandoned 

 VME on SEM E modules. This document appears to have been abandoned. The last version of the document that I could find was D1.3 dated 5/14/1997.

VITA 19.0-1997

6/13/1997

P. Fischer

Summary and Introduction to the BusNet Standard

ANSI VITA 19.1-1998

 3/11/1999

P. Fischer

BusNet Media Access Control (MAC) Specification

ANSI VITA 19.2-1998

 3/11/1999

P. Fischer

BusNet Link Layer Control (LLC) Specification

ANSI VITA 20-2001 (R2005)

2/20/2005
released

J. Kwok
I. Straznicky

CCPMC - Conduction Cooled PMC - This standard defines the mechanical requirements for compliance with conduction cooled PMC modules. This 21 page reaffirmed document not contains a reference to thermal corrosion due to vibration.

VITA 22-199x D0.1

2/6/1997

 

ATM Cells Bus (ACB) on VME – This is a serial fabric implemented on a VME 2mmHM P0/J0. This standard is based upon TransSwitch architecture.

ANSI VITA 23-1998 (R2004)

2/2004
reaffirmed

B. Downing

VME64 Extensions for Physics and Other Applications (VIPA). This 6U backplane standard includes lots of good 9U implementation information and supplier references. Additional power capability and additional signals are provided many of which are located on the P0 connector. It is also known as VME64xP is as well as 64x standard for physics.  This 125 page ANSI VITA document was reaffirmed in 2004.

ANSI VITA 25-1997

10/7/1998
released

J. Pangburn

VISION (Versatile I/O Software Interface for Open-bus Networks) - A software application interface for VMEbus modules.

ANSI VITA 26-1998 (R2003)

2003
reaffirmed

D. Cohen

Myrinet - This standard defines a packet switched interconnect protocol for implementation in a VMEbus environment. This 54 page document was reaffirmed in 2003.

ANSI VITA 29-2001

10/2001
released

K. Rubin

PC MIP Specification – A small form mezzanine module based on the PCI bus.

ANSI VITA 30–2000

8/2000
released

E. Parsons

2mm Connector Practices for Euroboard Systems

VITA 30–2000 d 0.1a

7/23/2001

abandoned

L. Francz
A proposed revision to the 2mm Connector Practices for Euroboard Systems. Originally requested by Lou Francz, this revision was to incorporate layout guide lines for implementing the differential connector known variously as the HM-Zd, ZD or more recently the ADF (Advanced Differential Fabric) connector. When PICMG aTCA departed from a Eurocard format, this became unnecessary.

ANSI VITA 30.1–2002

8/2002
released
failed reafirmation

R. Somes

2mm Connector Practice for Conduction Cooled Euroboards – This defines a 6U implementation of 2mm HM in a CompactPCI layout on a daughter card utilizing a cold plate. It defines keep out areas necessary for use with clamping card guides. This standard just failed to achieve  an acceptable number of returned ballots during a reafirmation ballot.

IEC VITA 30.2-2001

5/2001
released

L. Francz, E. Parsons

Separable Power Connector Equipment Practice – Defines the pin out implementation and provides power rating curves for a wide variety of power connectors that can be used in 6U-160 board applications such as was initially defined in PICMG 2.0 R1.0

VITA 31-200X draft 0.5

1/9/2001

abandoned

M. Thompson

Serial I/O on 2 mm Connectors (P0) and cables as used in VITA 31.1 This document ended with draft 0.5. VITA 31.1 included enough mechanical data to be self sufficient and the effort begun on VITA 41 made any further P0 efforts unlikely.

ANSI VITA 31.1-2003

6/2003
released

M. McPherson

Gigabit Ethernet on VME64x Backplanes – This defines the use of a PICMG 2.16 switch fabric in conjunction with a VME64x environment where the node cards are 6U VME cards with 4 Tx pairs and 4 Rx pairs located in the upper rows 2-5 of the VME P0 connector. Rows 1 and 6 are ground rows. A standards PICMG 2.16 switch card would be implemented within one or more slots of the VME64x backplane.

ANSI VITA 31.2 no draft

11/20/2003

S Cristo, B. Sullivan

Star Fabric on VME64x P0 Backplanes - This activity was introduced at the November VSO meeting. 

ANSI VITA 32-2003

7/ 2003
released

G. Novak

Processor PMC- This standard is consistent with IEEE 1386 (CMC) and IEEE 1386.1(PMC) with the exception that some previously undefined pins are assigned to processor functions and a tall format mezzanine height is defined to allow the space for larger components such as heat sinks.

VITA 34.0 draft 0.11

6/5/2001 abandoned

B. Downing

A Scalable Modular Electromechanical Architecture. This was mainly a concept effort for power, cooling and form factor. VITA 48 appears to be a practical implementation of the most practical features.

ANSI VITA 35-2000

4/2000
released

J. Kwok

PMC-P4 Pin Out Mapping To VME-P0 and VME64x-P2

VITA 36 D0.1

7/19/1998 abandoned

W. Fischer

PIM PMC I/O Module Standard. Greg Novak will renew this effort when VITA 32 is completed.

VITA 37 PIRMA no draft

2/15/2000
abandoned

J. Botte
L. Thopson
M. MacPherson

Product Integrity Requirements for Mission Critical Applications. The sponsors of this activity are: Nortel, MITRE, and CRANE. This task group will quantify the commonalties between military and telecom requirements. A Scope document for PIRMA was presented by M. MacPherson in September of 2000.

ANSI VITA 38-2003

1/2003
released

M. Thompson

System Management on VME- This 18 page ANSI VITA standard defines the implementation of an I2C IPMB bus on 5 J1/P1 VME pins. With the exception of the node board connector style this implementation is consistent with PICMG 2.9 System Management.

ANSI VITA 39-2003

8/2003 released

M. Franco

PCI-X Auxiliary Standard for PMCs and Processor PMCs

ANSI VITA 40-2003

2003
released

D. Cohen

Service Indicators - Defines the colors, behaviors, placement, and labeling of service indicator lamps for boards, field replaceable units, and enclosures.

ANSI VITA 41.0 -2006

5/2006
released 

N. Steffensen

VXS VMEbus Switched Serial Standard Base Doc. The updates to the alignment modules were implemented in the RTM document.. This 60 page document is now a released ANSI VITA standard.

ANSI VITA 41.1-2006

5/2006
released

M. German

VXS 4X Infiniband (tm) Layer Protocol Standard is now a released ANSI -VITA document and is  26 pages long.

ANSI VITA 41.2-2006

5/206
released

E. Yu

VXS 4X Serial Rapid IO Protocol Layer Standard. This released ANSI/VITA document is 27 pages long.

VITA 41.3-200X- revision 0.2

7/5/2005

M. German

VXS 1000Mb/s Gigabit Ethernet Protocol Layer Standard.  This 26 page document reflects the changes that were made as a result of the 12/20/04 ballot.

VITA 41.4-200X draft 0.2

2/21/2005

M. Rush

VXS 4x PCIxpress Protocol  Layer Standard VXS.4 products will comply with PCI Express Signal, Link, Transport, and Management layers in order to maximize interoperability with other PCI Express hardware and software products. This document is now at 24 pages.

VITA 41.5-2006  draft 0.1

4/19/2006

D. Bosworth

Aurora Protocol over switched VXS backplane. The Aurrora protocol is designed to be an ideal implementation for Xilinx Rocket IO. The initial draft is 23 pages long.

VITA 41.6-200X Draft 3

8/8/2008

K. Sheth
M. Munroe

VITA 41.6 VXS 1X Gigabit Ethernet Control Channel Standard. This standard will provide a 2-pair (4-wire) control channel mapped from the switch slot J1 to the J0 of each payload slot. Although this channel will make use of J0 payload connector pins that were previously reserved for future use (RFU) connector pairs in the switch slot that have previously been assigned to the IPMI bus will have to be reassigned. This new Gigabit Ethernet control channel will be used to initiate applications, configure processors, reprogram resources . This channel will be independent of any other fabric in a VXS system. This document passed the ANSI Sponsor ballot and is in the final ballot resolution phase. This document is now 35 pages long.

VITA 41.7-200X draft 0.5a

1/25/2007

M. Munroe

Processor Mesh on VXS. This validation standard will define a new functional backplane area consisting of a 4x redundant fully meshed backplane segment compatible with the fabric switch slot channel assignments. By extending the two central fabric channels, A and B, to each of these slots and also assigning a minimum of two channels to rear IO, this meshed segment will support application processes that require the resources of more than two boards. Because this is a point-to-point full mesh, this backplane segment will support FPGA SERDES IO protocols such as Aurora or Altera Lite while leaving the central IO channel for IO and management uses.  By moving processor intensive functions off the fabric switch cards less expensive fabric switches are now practical. This document offers three different signal assignment tables for VXS  connector J1 which allow for "on-board" or "off-board" system management controllers or the control plane GigE switch.This draft document has is currently 57 pages long. Draft 8 of a white paper which has implications for the processor slots was circulated to the reflector on 12/21/2006. and this document is awaiting review by the working group. It may be necessary to reform the working group due to inactivity.

VITA 41.8 no draft

9/2007

A. Reddig

VITA 41.8 - 10Gigabit Ethernet on VXS. This document is in the planning stage with no draft available.

VITA 41.9 no draft

6/13/2003

J. Sherman
abandoned

VITA 41 and VITA 41.2 extended for 9U VME. This activity was abandoned.

VITA 41.10-2003 rev 1.0

1/22/2003
Trial Use Std.

S. Paavola
spaavola@analogic.com
paavola@analogic.com

Live Insertion System Requirements for VXS Boards. This document has passed working group ballot and is available as a trial use standard.

VITA 41.11-2005 draft 0.6.8 passed VSO ballot ready to send to ANSI

7/15/2006

W. Dennen

RTM for VXS Switched Serial Standard. This document provides the mechanical and electrical requirements for 6U x 80 mm rear transition modules for VXS. A new board depth, new rear connectors and new alignment modules are defined. The front panels mechanics and card orientation is the same as defined by IEEE 1110.11. This document has now passed VITA ballot and is ready to be sent to ANSI. This document is 23 pages long.

ANSI-VITA 42.0-2008

12/2008
released

A. Reddig
P. Dozier

 XMC Switched Mezzanine Card Auxiliary StandardLayer Standard. This standard will build on PMC so that a socket on a carrier board will support both XMC and PMC cards. The key mechanical dimensions remain the same. This is now a released ANSI trial use standard and 42 pages long.

ANSI-VITA 42.1 -2006 

2/2006
released

R. Banton

XMC Switched Mezzanine Card: Parallel Rapid IO™ 8/16 LP-LVDS Protocol Layer Standard
This is now a released ANSI/VITA standard and 32 pages long.

ANSI-VITA 42.2 -2006

2/2006
released

P. Dozier

XMC Serial Rapid IO Protocol Layer Standard. This is a released ANSI/VITA standard which is 17 pages long.

ANSI-VITA 42.3 -2006

2/2006
released

L. Brown

XMC PCIxpress IO Protocol Layer Standard This 36 page standard is a released ANSI/VITA standard.

VITA 42.4-200X draft 0.2

5/15/2005
innactive

K. Boyette

XMC HyperTransport Protocol Layer Standard. This document has not progressed in more than 4 years.

VITA 42.5-200X no draft

8/22/2005
innactive

A. Reddig

Aurora Protocol over XMC mezzanine. This is another proposed mapping of the Xilinx Rocket IO over the XMC mezzanine standard. This is a proposed activity but no committee has yet been formed. This document has not progressed in more than 4 years.

VITA 42.6-200X draft 0.12

11/10/2009

Wai Ho Wu

XMC 10 Gigabit Ethernet 4-Lane Protocol Layer Standard. This document defines the implementation of 10G 4-lane XAUI over the XMC socket. The document is now 19 pages long.

VITA 42.10-200X draft 0.12

1/10/2006
inactive

L. Brown
 

Pin outs for XMC This “living” document is a registry of pin assignments that have been defined by users. This is not a standard, but serves as a forum to capture information regarding current practice. The intention is to allow people to duplicate existing pin assignments where practical. This document, however has not progressed in over 3 years.

VITA 45S draft 0.91

 

7/21/2004

abandoned

H.Strass

Serial VME This standard is intended to encapsulate the VME protocol within a serial bit stream much as been done for SCSI, PCI and RapidIO. Unfortunately there does not seem to be sufficient interest and this may be tabled. This document has not progressed in over 5 years.

ANSI-VITA 46.0-2007 

10/2007
released

I. Staznicky
(J. Kwoc)

VPX Baseline Standard. This specification is intended to provide for users: The advantage of high-speed interconnect technologies, electrical compatibility with VMEbus and VMEbus software, framework for heterogeneous architectures, 3U and 6U solutions and a mechanical structure for harsh, rugged environments with the necessary cooling. V46 will support a variety of multi-gigabit differential signaling including: serial Rapid IO, PCI Express, PCIe Advanced Switching and full mesh fabrics. The document now has an example of a 5-slot full mesh that could be used with PCI Express or Rapid IO. This document is now a released ANSI-VITA standard and is 107 pages long

ANSI-VITA 46.1-2007

10/2007
released

J. Kwok

VMEbus Signal Mapping on VPX. Parallel VME64x signals on VITA 46. This 30 page document extends the VME64x bus onto the VITA 46 backplane. The mapping takes up the J2 connector on the backplane entirely. On the daughter card it requires use of a single ended version of the MultiGig connector in position P2 but on the backplane it is only a new set of signal assignments for the J2 but the MultiGig does not have a separate version for single ended signals.
The remaining VMEbus signals that cannot fit on the J2 connector are scattered across the single ended signal positions on the remaining J3, J4, and J5. J6 does not carry any VMEbus signals.  These single ended positions are just at the end of every other wafer and therefore don't interfer with the existing differential mappings to those connectors. A 3U version will not support 64 bit bussing but will support  the A24 D16 VMEbus transactions. The 6U implementation of 46.1 supports A32 D32 transactions. This document is now a released ANSI VITA standard and is 33 pages long.

VITA 46.2 no draft

1/2005
abandoned

t.b.d.

Parallel PCI on VITA 46 . I just changed this status to abandoned. This document was proposed in January 2005 according to my records but there has not been sufficient interest to move forward with.

VITA 46.3-200X draft 0.9

2/24/2009

D. Toohey
D. Holman

4x Serial Rapid IO on VITA 46  David Toohey has just begun updating this document.  A couple of pages may have been removed or condensed as the document is now 21 pages (down from 24) and still has the Sept. 26, 2005 date on the front cover.  An electrical loss budget was proposed on 5/17/06. A decision is also being made to rename the backplane connectors "J" and daughter card connectors "P". A glyph is being considered and there is a question regarding the need for any reserved P1 SE pins for future use. This document is now 24 pages long.  The ballot for this document closed on March 13, 2009.

VITA 46.4 draft 0.7

1/6/2009

Val Gueorguiev

PCI Express on VITA 46 . This document  has preliminary pin outs and is 20 pages long.  There has been an extensive discussion of clock distribution and use of REF clock.

VITA 46.5-200X draft 0.1

6/24/2005
inactive

E. Kheyfets.

Hypertransport on VITA 46  This draft document is 29 pages long.

VITA 46.6 no draft

9/11/2007
abandoned


Gigabit Ethernet on VITA 46  Some work has recently taken place in VITA 46.0 to create a location for Gigabit Ethernet signals for both 3U and 6U form factors. On September 11 this document was discontinued and the material will be covered in VITA 46.7 which will be 10G BASE KX-4 on J2

VITA 46.6 no draft 

3/9/2009

D. Toohey

Gigabit Ethernet Control Plane on VPX. This document will cover the implementation of a Gigabit Ethernet Control Plane on VPX. This document will be separate from the implementation of Gigabit and 10G Ethernet serial fabrics used for data planes and expansiion planes on VPX.  Electrical requirements will be defined within VITA 68. This effort does not yet have a first draft.

VITA 46.7 draft 0.07

5/11/2009

S. Goedeke

Ethernet  on VPX Fabric Connector. This document will define the implementation of various Gigabit Ethernet protocols on the VPX fabric connector J1/P1. This document will cover 10GBase-KX, 10G-BaseKX4, 1000Base-BX and any other required Ethernet protocols being implemented as a serial data plane on VPX. The document was intially being focused on VITA 46.20 but is now a general implementation focused on VITA 46 and VITA 65. This document will not address a Gigabit Control Plane which is the subject of VITA 46.6. This document is currently 21 pages long.

VITA 46.8 no draft 

2005
inactive

t.b.d.

Infiniband on VITA 46

VITA 46.9 draft 0.24

12/15/2009

J. Goldenberg
(J. Kwok)

XMC and PMC Mezzanine IO Mapping on VITA 46. This document addresses PMC/XMC mapping on VPX. Because of the potential for interoperability issues and the competition for IO connector locations within VPX this work was set aside for some time as the OpenVPX initiative began its work. Now that that work is nearly complete, work on this document has resumed. This document is now 84 pages long. 

VITA 46.10 draft 0.10

9/17/2009

I. Straznicky

Rear Transition Module (RTM) for VITA 46.  The backplane connector is numbered from bottom to top on the rear side. Due to the connector design and the requirement for a closed connector, row 1 is not populated in the rear. For this reason there are only two  power wafers but since the first two power wafers were redundant, all voltages are available on the RTM. The VPX RTM is 81 mm long due to the connector design. This document is now 39  pages long.

VITA 46.11 draft

2005
withdrawn

t.b.d.

ASI (PCI Advanced Switching) on VITA 46 It appears with the addition of Advanced Switching to VITA 46.4 that plans for this document may change soon.

VITA 46.11 no draft released

3/10/2009

D. Toohey

System Management for VPX. This will be an implementation of VITA 38 in a VPX system.

VITA 46.12 draft

2005
obsolete

S. Dewer

Keying Standard for VITA 46

VITA 46.12 draft .3

11/7/2008
moved to VITA 66

B. Ford
M. Cassels

Fiberoptic IO for VITA 46. This project has just been started. The work has begun on this document. At the pressent time, Tyco and Amphenol have not agreed on an interim optical connector design for specific reasons.  The following contact configurations are being considered, MT style, MIL-T-29504 and expanded beam. Updated criteria for selection have been finalized and recently Tyco made necessary statements regarding licensing. Dimensions will be added to the document. The document is now 28 pages long. This document was moved to VITA 66.0 and 66.1.

VITA 46.14 draft .1

10/31/2009
moved to VITA 67

R. Normoyle

Mixed RF signals on VPX. The proposed connector is an eight position RF module with float. Cable interface and EMI.RFI o-rings are available. Tyco is preparing for environmental testing. Tyco made necessary statements regarding licensing. Dimensions will be added to the document.  This document is now 27 pages long. This document was moved to VITA 67.

VITA 46.20 draft .2

8/30/2008
within VITA 65

N.  Arshad

Base fabric switch. This document will define star and dual star Gigabit fabrics in conjunction with the transport fabric. There is no document at the present time however firm channel locations for 3U have been proposed. Nauman is working actively on this document and hopes to bring out a first draft in the next week. This document is 28 pages long. The topologies covered by this document are now addressed within VITA 65.

VITA 46.21 draft .01

2/16/2009
within VITA 65

S. Goedeke

Base fabric switch. This document will define star and dual star Gigabit fabrics in conjunction with the transport fabric. There is no document at the present time however firm channel locations for 3U have been proposed. Nauman is working actively on this document and hopes to bring out a first draft in the next week. The current document is 22 pages long. Since then we have resolved the choices to two 6U solutions one 5-slot with up to 10 expansion slots. The other is 8 slots with up to 16 expansions slots. The topologies covered by this document are now addressed within VITA 65.

VITA 46.x draft

2005
obsolete

t.b.d.

Live Insertion on VITA 46

VITA 46.y draft

2005
obsolete

t.b.d.

AMC on VITA 46

VITA 46.z draft

1/17/2007
superceded by 46.12

Martin Cassels

Optical Interface Connector on VITA 46. This is a proposed activity that is in a collection stage. This activity is not formed into a formal subcommittee yet. Watch for further details. This activity has been restarted as of 8/25/2007. There will be a major presentation at the November face-to-face.  A "dot" standard is planned and there may be two approaches, dense benign environment and sealed for a level 2 maintenance environment.

ANSI VITA 47-R1 2005 (R2007)

1/2005
released
superceeded

J. Robles

Environments, Design and Construction, Safety and Quality for Plug-In Units. This 21 page standard defines various environmental classes for modules of three basic designs; forced-air, conduction and liquid flow-through cooled modules. Within each of these broad divisions, there are individual environmental definitions based on operating and non-operating temperature, cooling cycle conditions, vibration levels and operating shock. The document goes on to specify a test method and specified values for each specified parameter.

ANSI-VITA 47 -2005 (R2007)

0/2007
released

D. Golden
M. Thompson

Environments, Design and Construction, Safety and Quality for Plug-In Units. The R1 version of this document is now being revised to update cooling and to add a 3U definition. This document is now an approved ANSI-VITA standard. This version is 22 pages long.

VITA 47r2 draft 0.14

1/6/2009

D. Golden
J. Robles

Environments, Design and Construction, Safety and Quality for Plug-In Units. The R2 version of this document is now being prepared to address EMI and EMC per IEEE PAR 1688 and to add additional profiles required for  VPX and rugged MicroTCA. The revised document is now 23 pages long.

VITA 48.0 draft 0.19a

5/17/2009

M. Gust
R. Banton (retired)
  

Mechanical Specifications for Microcomputers Using Ruggedized Enhanced Design Implementation (REDI) Many proposed mechanical implementations shown. This document introduces the features and concepts as well as card size, basic slot pitch and known intellectual property that are implemented as part of the air/conduction cooled 0.1 document and as part of the liquid cooled implementation defined in the 0.2 document. The introduction to this document previously cited nine patents on air cooling but these references were removed and replaced with a statement directing adopters to VITA for more information.  The name  of the standard was changed  to change the acronym from ERDI  to a more pleasing sounding REDI.  This draft no longer has the draft number in the footer but now has the draft date in the footer. The document is now 17 pages  long.

VITA 48.1 draft .21a

4/20/2009

M. Gust

Mechanical Specifications for Microcomputers Using REDI Air Cooling applied to VITA 46.  A great deal of design work has gone into this document. This document is now  44 pages long. This document with a file name with the r0d21a has a cover that says revision 14 dated 4/20/2009 and two different footers on various pages, some including "Rev. D0.19" and some with "Rev. D0.20." This document is nearly identical to draft 0.21 of the same date except for some formatting changes. Inexplicably draft 21a has the previously mentioned "draft 14 on the cover page and it's title no longer includes the text "applied to VITA 46."

VITA 48.2 draft 0.15

2/28/2009

M. Gust

Mechanical Specifications for Microcomputers Using REDI Air and Conduction Cooling applied to VITA 46 . This is a 50  page document and provides for a sandwich design with heat management layers on both faces of the daughter card.

VITA 48.3 draft 0.04

1/10/2007

R. Harvey
M. Gust

Mechanical Specifications for Microcomputers Using REDI  Liquid Flow through Cooling applied to VITA 46 . Parker Hannifin has proposed quick connect ports that are approximately 0.45" diameter and provide significant "gathering" as a replacement for a guide pin assembly. This extensive document is now 41 pages in length.

VITA 48.4

2008

R. Harvey

Mechanical Specifications for Microcomputers Using REDI  Liquid Flow through Cooling applied to VITA 46  with manifold above on 1.0" pitch.

VITA 48.5 draft 6.0

8/28/2009

M. Guest

Mechanical Specifications for Microcomputers Using REDI Air flow through Cooling as applied to VITA 46. The ballot for this document closed on 3/13/2009. It was at draft 3 and is 28 pages long.

VITA 48.6

2008

R. Harvey

Mechanical Specifications for Microcomputers Using REDI Liquid Flow throug Cooling  applied to VITA 46 with manafold above and outboard on 0.8" pitch.

 ANSI-VITA 49.0-2009

5/2009
released

A. Kaiway

ANSI-VITA Radio Transport Standard (VRT). This document addresses new methods being used to transmit and combine digital IF, analog IF and processed digital information. New methods are possible because of the availability of new chassis and backplane capable of processing digitized gigabit signal streams. The Digital IF group is planning additional standards that will layer above the Serial Front Panel Data Port (sFPDP) which is based on  ANSI/VITA 17.1-2003 and further enhanced by VITA draft 17.2. VITA 4 9 was developed outside of VITA but but brought to VITA for submission to ANSI. For more info visit, http://www.digitalif.org. This document is 179 pages long.

 ANSI-VITA 49.1-2009

5/2009
released

R. Normoyle

ANSI-VITA Radio Link Layer Standard.  This document was developed outside of VITA but was brought to VITA for ANSI standardization. It is 17 pages long.

VITA 50 draft 0.0 Cooling

2/15/2006

R. Harvey

Electronic Cooling - Best Practices. This document which describes liquid cooling of electronic systems and is intended to provide an overview of methods, advantages, disadvantages, relative effectiveness, relative reliability and relative costs of various available methods. This new draft is 37 pages long.

VITA 51 CoP

1/17/2007

C. Falardeau

A "Committee of Preference" (CoE) has been formed with strong participation. This group will work together to define best practices for the implementation of Mil HDBK-217F Notice 2. At the moment, a decision is pending on the location and operation of the web based Wiki.

VITA 51.0 draft 6-26-07 Reliability Prediction

6/26/2007

L. Bechtold

Reliability Prediction MIL HDBK-217. This document will be based on the methodology used for another reliability standard, IEEE 1413.1. Guidelines 2005, revised methods 20007 and new methods in 2008. This draft is now 40 pages long

VITA 51.1 draft 6-26-07 Reliability Prediction HDBK-217 daughter
6/26/2007
P. Miskelly
Reliability Prediction. This document is intended to provide a common and consistent approach for their application to electronics modules. This working group represents a collaboration of members of various OEM suppliers and representatives from the DOD. The document is now 29 pages long. This document will serve as a an enhancement to Mil HDBK-217.

VITA 51.2draft 6-26-07 Reliability Prediction

3/2009

L. Bechtold

Reliability Prediction MIL HDBK-217. This document will be based on the methodology used for another reliability standard, IEEE 1413.1. Guidelines 2005, revised methods 20007 and new methods in 2008. This draft is now 40 pages long

VITA 52.0 Lead Free, Aerospace and High Performance Systems

11/2005

L. Bechtold

Lead Free Lori Bechtold of Boeing has presented the most recent update on this activity. This work is to be based on GEIA-STD-005-1 draft 3.0 titled "Performance Standard for Aerospace and High Performance Electronic Systems
Containing Lead-free Solder ."
For information regarding the GEIA see: http://www.geia.org

 VITA 52.1 Mitigating Effects of Tin Whiskers.

4/6/2005

L. Bechtold

Lead Free Lori Bechtold of Boeing has presented the most recent update on this activity. This work is to be based on the 61 page document GEIA-STD-005-2 draft 3.2 titled "Standard for Mitigating the Effects of Tin Whiskers  in Aerospace and High Performance Electronic Systems."  For information regarding the GEIA see: http://www.geia.org

VITA 52.2 Lead Free Electronics Handbook

4/6/2005

L. Bechtold

Lead Free Lori Bechtold of Boeing has presented the most recent update on this activity. This work is to be based on a 26 page document , GEIA-HB-0005-1 draft 3.1 titled "System Engineering Guidelines for  Managing the Transition to Lead-Free Electronics. For information regarding the GEIA see: http://www.geia.org

VITA TA 53- 200x draft 4

3/18/2009

S. Cecil

COTS Commercial Market Surveillance Activities. This standard is an attempt to manage commercial technology and track COTS requests, product obsolescence, stock status, and end of production for ten COTS working groups across the country. This document just released its first draft which is now 22 pages long. At the 1/17/2007 VSO meeting S. Cecil reported that the study group is ready to transition into Working Group Status as they have just gained their third sponsor. ANSI balloting for this document is planned for summer of 2009. An article in VME and Critical Systems is planned.

VITA 54.0 EPMA

5/18/2005
stagnant

K. Boyette

ePMA Enhanced Platform Management Architecture. This standard defines an enhanced physical platform management architecture based on the AMD open license OPMA specification and the interface defined by IPMI. ePMA is intended to be suitable for use on commercial and ruggedized circuit card assemblies. This architecture will build upon VITA 38 and PICMG 2.9 which utilize the IPMI bus to implement a full platform management architecture. There has been no discernible activity in over a year.

VITA 54.1 no draft yet

5/18/2005 stagnant

K. Boyette

ePBMA Enhanced Management Structure for Backplane This standard defines a physical backplane interface standard for use on commercial and ruggedized circuit card assemblies. There has been no discernible activity in over a year.

VITA 54.2 no draft yet

5/18/2005 stagnant

K. Boyette

ePMMA Pluggable Management Module Architecture. This standard defines a pluggable management module suitable for use on commercial and ruggedized circuit card assemblies. There has been no discernible activity in over a year.

VITA 55.0-2006 draft 0.6

11/10/2006

P. Burns

Aurora LVDS Virtual Serial Streaming Protocol. This FPGA serial IO protocol is ideal for applications such as Xilinx Rocket IO and is very similar to Altera's Serial Lite. This serial protocol will support error detection but not error correction. This point-to-point serial data protocol may support both 8b/10b as well as 64b/66b data and is  ideal for meshed topologies but not sufficient for switched fabrics. This document is now 25 pages long. This document has been put on hold by A. Reddig as of March 2009.

VITA 55.1-2006 draft 0.1

11/10/2006

P. Burns

Aurora LVDS Virtual Serial Streaming Protocol Aurora Link Encapsulation. This document is 12 pages long. This document has been put on hold by A. Reddig as of March 2009.

VITA 56.0-200X draft 0.30

12/11/2006
glacial

D. Slaton

Express Mezzanine Card Base Standard. This standard will define a hot pluggable mezzanine card that will be compatible with VME and CompactPCI and use a PMC like bezel. The card size will be 74 x 149 mm and it is expected to use a edge card connector interface much like AMC. A X4 PCIxpress interface will be a minimum requirement but other "fat pipe" arrangements and common options are expected to have defined areas. At the present time, the committee is meeting every other week. A new connector decision is the most critical action to be completed. This document is now 55 pages long.  I cannot tell if this activity is abandoned or mearly making glacial progress.

VITA 56.1-200X draft 0.02

8/22/2006
glacial
D. Slaton

PCI on an Express Mezzanine Card Standard. Currently, this standard is considering how much grainularity of PCI Express to support. x1, x4, x8 and x16 will certainly be supported. The mention of x12 is just due to the actual number of signal pairs that are available for the link so this terminology is subject to change. The e-keying section needs to be completed. I cannot tell if this activity is abandoned or mearly making glacial progress.

VITA 56.2-200X draft 0.01

11/30/2005
glacial
D. Slaton

Ethernet on an Express Mezzanine Card Standard. This appears to be abandoned.

VITA 56.4-200X5 draft 0.01

11/30/2005
glacial
D. Slaton
C. Eckert
Serial Rapid IO on an Express Mezzanine Card Standard. This appears to be abandoned.

VITA 56.10-200X draft 0.01

11/30/2005
glacial
D. Slaton
C. Eckert
Conduction Cooled Express Mezzanine Card Standard. This appears to be abandoned.

VITA 56.20-200X draft 0.02

12/11/2006
glacial
D. Slaton
C. Eckert
General Purpose Interfaces on an Express Mezzanine Card Standard. Interfaces will include but not be limited to USB, SATA, RS232, RS422, RS485 etc. . .  At the January '07 VSO meeting, the completion of the I/O specification was listed as the current goal. This document is now 9 pages long. I cannot tell if this activity is abandoned or mearly making glacial progress.

ANSI-VITA 57.1 2008

7/2008
released
M. Devlin
ANSI VITA FPGA Mezzanine Standard (FMC)  define the form factor, signal assignments for a mezzanine card designed to support FPGAs. The  single high module is 69 mm x 139 mm. A 4 x 40 grid is defined from the SAMArray connector family.  Various stacking heights from 8.5 to 10 mm will be allowed. A card may have both PMC and XMC sockets. This document is 79 pages long.

VITA 57.1 2009 draft 0.19

2/18/2009
M. Devlin
FPGA Mezzanine Standard (FMC)  draft will re-defined clocks signals from the carrier card to the mezzanine card; CLK0_C2M_N, CLK0_C2M_P, CLK1_C2M_N, CLK1_C2M_P. It is proposed that these signals will now be redefined as additional ‘M2C’ signals. The work on this document is in progress.

VITA 57.2 200X draft .0 Driver IP

6/24/2006
M. Devlin
FPGA Meta data description for physical support specified for IO. This first draft is now 29 pages long.

VITA 57.3 200X no draft

6/24/2006
M. Devlin
FPGA driver IP Standard. This document will define the necessary Driver IP that may have to be incorporated into an FPGA to interface to the above mezzanine hardware standard. This first draft is now 29 pages long.
VITA 58.0 draft 0.8
8/27/2008
Dan Golden
M. Humphrey
D. Grisaffi
 Eron Strod

Line Replaceable Integrated Chassis (LRU) standard defines the interface requirements necessary to implement a replaceable chassis design. The document will include the design of truses or stalks for power, electrical and optical connections as well as latches for a Least Removable Unit (LRU) electrical package suitable for the future land assault vehicle FLAS. The design concept is to be based upon previous work created by Carlson Engineering for the Department of Defense. The initial draft document is 28 pages long.
VITA 58.1 draft 0.1
11-17-2009
Bruce Thomas
Line Replaceable Integrated Chassis (LRU) Liquid Cooled. This document will define the interface requirements for a liquided cooled LRU. The initial draft document is 22 pages long.

VITA 59 200X draft 0.2

4/7/2008

Michael Plannerer
Rugged System on Module Express (RSE). This standard will define the implemention of Comm Express in a Eurocard form factor . This document is now 46 pages long.

VITA 60 200X no draft

9/2009
G. Powers
XMC Alternative Connector for OpenVPX.

VITA 61-200X no draft

3/18/2009
B. Grochmal
Open VPX family of standards implemented on the Viper pin and socket connector on 1.0" pitch.

VITA 62

2009
Samtec
VITA 42 XMC implemented on  a solder ball connector.  This activity was cancelled.

VITA 62 draft 0.01

7/20/2009
Pat Shaw
A Power Supply Standard for OpenVPX. This document is defining a COTS power supply and the connector interface for use with OpenVPX. The document is now 24 pages long.

VITA 63  no draft

11/19/2009
J. Demers
A Standard to define the implementation of OpenVPX on the KVPX Hypertronix connector.

VITA 64 no draft

11/19/2009
D. Dix
VPX family of standards implemented on the Viper  pin and socket connector on 0.8" pitch.

VITA 65 draft 1.05

1/5/2010
P. Jha
G. Rocco
OpenVPX System Standard. This document was developed initially by the technical workng group of the OpenVPX Initiative. The initiative held its first face-to-face meeting in March of 2009.  As part of the memmorandum of understanding for that trade association, the final document was turned over to VITA and is now VITA 65. This standard will implement a new descriptive language for module, slot backplane and system profiles that can be used to define VPX system elements. It introduces the terms, quad fat pipe, double fat pipe, fat pipe, thin pipe and ultra-thin pipe for serial fabric channels used within VPX backplanes. The standard will also define a standard module, slot and backplane profiles that can be used for VPX development systems. The goal is to simplify the implementation of VPX systems and to ensure interoperability.  The document is the focus of an intense writing effort and is now 409 pages long.

VITA 66.0 (46.12) draft 0.04

11/18/2009
B. Ford
Optical Interconnect on VPX Base Standard. This document is the core of a family of documents that will define the implementation of backplane optical connectors on the VPX family of standards. The optical connectors may occupy 6U connector locations J2/P2 through J6/P6 and location J2/P2 on 3U VPX backplanes and cards. This document was formerly VITA 46.12 and is now 15 pages long.

VITA 66.1 (46.12) draft 0.51

12/3//2009
B. Ford
Optical Interconnect on VPX - MT Variant. This document defines the implementation of an MT optical backplane connector on cards and backplanes built to the VPX family of Standards.  This document was formerly VITA 46.12 and is now 19 pages long.

VITA 67 (formerly 46.14) no draft

10/31/2008
R. Normoyle
Analog RF Connector for OpenVPX. Ths document was formerly VITA 46.14. This standard will cover the implementation of an 8 cavity coaxial RF connector in position P6/J6 for 6U modules and a 4 or 8 cavity coaxial RF connector in connector position P2/J2 for 3U modules. The existing 46.14 document is at draft 0.1 and is 27 pages long.

VITA 68 draft 0.12

11/18/2009
B. Sullivan
This is a channel requirements document that will cover the electrical requirements for various signaling protocols being implemented within the OpenVPX family of standards. It is currently 17 pages long.

VITA 69 draft 0.01

10/20/2009
B. Ford
A VITA Standard Glossary. This document will contain glossary terms that have been developed in various VITA documents. The document is currently 15 pages long.

VITA 70 draft 0.20

10/20/2009
B. Ford
VITA Standard Template. This is not a standard but simply the a standardized template that can be used by VITA working groups to start a new standard.




VXIbus Consortium

 

    

http://www.vxibus.org

VXI-1 Rev 3.0 VXIbus System

 

11/24/2003

VMEbus Systems Specification covers the backplane, front panels, keying, modules, shielding and environmental specifications

VXI-2 Rev 1.0 Extended Registers

 

 

VXIbus Extended Register Based Devices and Extended Memory Device Specification

VXI-6 Rev 1.0 VMEbus Mainframe Extender

 

 

VXIbus Mainframe Extender Specification

VXI-8 Rev 2.0 Cooling Characterization

 11/1997


VXIbus Cooling Characterization Methodology Specification

VXI-11.3 draft 0.3 TCIP IEEE 488.2 Instrument Specification

 

 

VXIbus interface specification for use with IEEE488.3

 

 

 

 

LXI Consortium


http://www.lxistandard.org
LXI Standard Revision 1.0
9/23/2005
LXI Consortium
Lan Extension for Instrumentation or LXI is a test equipment specification that used Ethernet to connect various test equipment modules into a single instrument. This document is 113 pages long and was driven by a consortium founded by Agilent.
LxiSync Revision 1.0
9/23/2005
LXI Consortium
This LxiSync specification defines the API for controlling the arming, triggering, and event functionality of LXI devices. This functionality applies to LXI Class A and B devices but does not apply to the IVI instrument class that may be supported by the device. The LxiSync Interface Specification interprets an LXI instrument as one that can recognize and respond to LXI trigger bus events or LAN based LXI events. This document is 156 pages long.
LXI Standard  v1.0  s6.4.2
12/14/2005
LXI Consortium Clarification for rule: 6.4.2
LXI Standard  v1.0  s7.3.1
11/3/2005
LXI Consortium Clarification for rule: 7.3.1
LXI Standard  v1.0  s7.3.1.1 11/17/2005
LXI Consortium Clarification for rule: 7.3.1.1
LXI Standard  v1.0  s7.5 1/12/2006
LXI Consortium Clarification for rule: s7.5
LXI Standard  v1.0  s8.7.1
10/20/2005
LXI Consortium Clarification for rule: 8.7.1
LXI Standard  v1.0  s9.1
11/11/2005
LXI Consortium Clarification for rule: 9.1
LXI Standard  v1.0  s9.5
12/13/2005
LXI Consortium Clarification for rule: 9.5
LXI Standard  v1.0  s9.6
12/13/2005
LXI Consortium Clarification for rule: 9.6
LXI Standard  v1.0  s9.8
11/11/2005
LXI Consortium Clarification for rule: 9.8




Serial Rapid IO Trade Assoc.


http://www.rapidio.org
RapidIO Spec. 1.3 Part 1
6/2005

IO System Logical Layer. Defines many different types of  transactions.
RapidIO Spec. 1.3 Part 2
6/2005
Message Passing Logical Layer
RapidIO Spec. 1.3 Part 3
6/2005
Common Transport.
RapidIO Spec. 1.3 Part 4
6/2005
Parallel Physical Layer Specification.
RapidIO Spec. 1.3 Part 5
6/2005
Global Shared Logical Layer
RapidIO Spec. 1.3 Part 6
6/2005
Serial Physical Layer Specification.
RapidIO Spec. 1.3 Part 7
6/2005
Interoperability Physical Specification. This includes data headers, encoding, symbol generation, buffer function, lane striping and the electrical characteristics of the driver and receiver.
RapidIO Spec. 1.3 Part 8
6/2005
Error Management Extensions. This document defines optional error management including: registers, maintenance transactions, state capture, and reporting.
RapidIO Spec. 1.3 Part 9
6/2005
Flow Control Extensions. Optional extensions to manage traffic, congestion and XON/XOFF controls
RapidIO Spec. 1.3 Part 10
6/2005
Data Streaming Logical Layer - Phase 1.
RapidIO Spec. 1.3 Part 11
6/2005
Multi-cast Extensions
RapidIO Spec. 1.3 Annex 1
6/2005
Software and System "bring up" guide. Supplements the interoperability document.
RapidIO Spec. 1.2

Earlier specification still available.
Hardware Interop. Platform 11/2002

Defines mechanical and electrical requirements to endure interoperability. (only available to members of T.A.)
Interop. Checklists Rev 1.3 9/2005

Device Compliance Checklist: For compliance to revision 1.3 of the Serial Rapid IO Specification (only available to members of the T.A.)
Bus Functional Model (BFM)

A functional "C" model with a Verilog(tm) wrapper to be used to test for interoperability. (available under license only to members of the T.A.).




IEEE/ANSI Standards

 

 

http://standards.ieee.org 

IEEE 181-1977

9/15/1993
withdrawn

O. Solomon

IEEE Standard on Pulse Measurement and Analysis by Objective Method. This standard was created by the IEEE Instrument and Measurement Society for TC10 waveform analysis. 

IEEE 181-2003

7/11/2003

N. Paulter

IEEE Standard on Transitions, Pulses, and Related Waveforms. This standard combines IEEE standards 181-1977 and 194-1977 into one document
which addresses transitions, pulses and related signals and defines procedures for estimating their parameters.

IEEE 194-1977

9/15/1993
withdrawn

O. Solomon

IEEE Standard Pulse Terms and Definitions. This 63 page document defined the nomenclature used for the pulse measurement technique. This material was incorporated into IEEE 181-2003.

IEEE 696-1983 Interface Devices

6/10/1982

M. Garetz

S-100bus This standard applies to interface systems for computer system components interconnected by way of a 100-line parallel backplane commonly known as the S-100 bus.

IEEE P 802.1ag

7/10/2006

A.A.Jeffree

P802.1ag Standard for Local and Metropolitan Area Networks Virtual Bridged Local Area Networks Amendment 5: Connectivity Fault Management

IEEE 802.3-2002

5/13/2002
released
superceeded


Includes 10/100/1000 BASE-T signaling over structured wiring. 802.3-1998 superceeded 802.3-1995 and the new features adopted as versions ab, ac and ad were incorporated into 802.3-2002 which in turn superceeded 802.3-1998.

IEEE 802.3ae

12/22/2002
released
superceeded


Includes 10/100/1000 BASE-T signaling over structured wiring. The contents of this document were incorporated into 802.3-2003.

IEEE 802.3af

9/22/2003
released
superceeded


DTE power via MDI also known as Power over Ethernet.  The content of this document was uncorporated into 802.3-2003.

IEEE 802.3ap

2/14/2007
approved

A. Healey

10 Gigabit Ethernet Backplane standard. This Ethernet document defines three new Ethernet standards for backplane implementations. These versions are intended to function across two backplane to daughter card connector interfaces and 30 inches of unimproved FR-4. The single channel implementation offers 10 Gigabites per second bi-directional Ethernet. The three implementations are 1000BASE-KX, 10GBASE-KX4 and 10GBASE-KR. Because this is a generic backplane implementation, no specific connectors are defined. Furthermore many of the basic electrical performance characteristics are addressed with informative language rather than specific normative requirements. This group worked for two years and no greater level of agreement was possible. Draft D33 was the version of the document that was balloted and was 199 pages long.

IEEE 802.3 100 Gigabit Ethernet BP Study Group

study group

J. Joergen
J. D'Ambrosia

Just as IEEE 802.3ap was ratified, a new study group was formed to begin work on a 100 Gigabit Backplane Ethernet Study Group.  It is believed that the goal of this standard will be 100 Gigabit Ethernet over four lanes of 25 Gigabit per second capability.

IEEE 802.3-2003

12/9/2003
released
superceeded


Systems Networking Guide: How to Optimize Your Network Using the ISO/IEC 8802-3 Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Standard. This has been updated on a regular basis. The version ending in -2003 incorporates versions ae, af and ag and all the features that were previously incorporated into 802.3-2002.

IEEE 802.3 EFM

3/30/2006
released


Ethernet in the First Mile (EFM) standard. This is a comprehensive document that covers the entire family of Ethernet standards. It introduces the terminology and evolution of the various standards and helps lay out the essential considerations that a business model must consider when chosing a specific Ethernet technology. This document  was, during development, P802.3ah

IEEE P 802.3amREV

5/11/2005
released
superceeded

D. J. Law

Information technology -- Telecommunications and information exchange between systems -- Local and metropolitan area networks -- specific requirements Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications.  This draft was accepted and became IEEE802.3-2005 in December of 2005 and was published in 2006.

IEEE 802.3-2005

2/21/2006
released


Systems Networking Guide: How to Optimize Your Network Using the ISO/IEC 8802-3 Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Standard. This has been updated on a regular basis. The version ending in -2005 was known during development as 802.3-REVam and incorporated the features of 802.3-2003, ah and av

IEEE P 802.3 2005-Cor 1D2.0

9/28/2006

D. J. Law

P802.3-2005-Cor_1 Information technology Telecommunications and information exchange between systems Local and metropolitan area networksSpecific requirements Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) access method and physical layer specifications Corrigendum 1. This updates 802.3-2005 with the changes needed to fully implement the af revision.

IEEE P. 802.3an D4.0

10/24/2006

R. Grow

This update to Gigabit Ethernet has now completed sponsor ballot, it is approved and submitted to REVCOM

IEEE P 802.3ap D3.3

1/27/2007

A. Healey

CSMA/CD Access Method and Physical Layer Specifications Amendment: Ethernet Operation over Electrical Backplanes 10 Gig single channel (if they do this over a single channel, and specify the path adequately, it will be a very significant accomplishment) http://www.ieee802.org/3/ap/  On February 13, 2007 draft 3.3 completed its third recirculation ballot successfully with no negative comments. This 199 page draft will be presented at the next  IEEE REV Com meeting and will then be prepared for publication and public release. 

IEEE P 802.3aq D4.0

7/20/2006

D. J. Law

P802.3aq Information technology -- Telecommunications and information exchange between systems -- Local and metropolitan area networks -- specific requirements Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications Amendment: Physical Layer and Management Parameters for 10 Gb/s Operation, Type 10GBASE-LRM

IEEE P 802.3as D3.3

8/18/2006

D. J. Law

P802.3as Information technology - Telecommunications and information exchange between systems - Local and metropolitan area networks - Specific requirements Part 3: Carrier sense multiple access with collision detection (CSMA/CD) Amendment: Frame format extensions

IEEE 802.11b

 


Wireless LAN

IEEE 802.11g

 


Wireless LAN

IEEE Std 896.1-1991

9/26/1991 withdrawn

P. Borrill

IEEE Standard for Futurebus+ - Logical Protocol Specification. This standard was withdrawn December 9, 1997

IEEE Std 896.2-1991

9/26/1991 withdrawn

J. George

IEEE Standard for Futurebus+ - Physical Layer and Profile Specification. This standard was withdrawn December 9, 1997

IEEE P896.3a

10/1994
withdrawn

M. Munroe

Recommended Electrical Practices for Futurebus. This standard was to define the backplane electrical requirements for incident wave switching on Futurebus backplanes. The extraordinarily high di/dt of a 256bit wide parallel, multi-drop bus environment was defined which established requirements for termination response.  I am not sure why Bill Schneider's name is associated with the PAR.  M. Munroe opened the PAR and David Wright was the significant additional contributor. This PAR was withdrawn by the IEEE.

IEEE Std 996-1990

1991

S. Hopkinson

PC-AT Standard for a Personal Computer Bus

IEEE Std 1014-1987

3/28/1988

Sven Rau
Max Loesel
Craig McKenna
Cecil Kaplinsky
J. Black
Shlomo Pri-Tal
Lyman Hevle

W. Fischer
M. Pauker
E. Waltz

IIEEE Standard for A Versatile Backplane Bus: VMEbus –  IEEE 1014/D1.2 (also IEC 821Bus) which was based upon the VMEbus Specification Manual Revision C.1 first published by VITA.  Lyman Hevle is credited with naming the new architecture VME. The VMEbus was based upon Motorola’s VERSAbus which was discussed in a 1981 publication. John Black lead the development of VERSAmodule and Sven Rau and Max Loesel first prototyped the Versabus adaptation in the Eurocard Format which appeared in October 1981 as VERSAmodule E. John Black and Craig McKenna and Cecil Kaplinsky authored the first draft of the VMEbus specification which as Revision A was placed into the public domain also in 1981. Revision B followed in 1982 and the European standard SC47B was begun with Mira Pauker. Revision C and C.1 were authored by John Black and Shlomo Pri-Tal  following a meeting in 1983 that included Craig McKenna, Mira Pauker and W. Fischer. IEEE 1014/D1.2 was begun in 1983 with John Black as chair. IEC 821 was the equivalent project.  The VME International Trade Association (VITA) was founded by Lyman Hevel in 1985 following the October 1985 publication of VMEbus Specification Manual Revision C.1 Other contributors to the VMEbus were Eike Waltz and Paul Borril. IEEE 1014 is not identified as "stabilized" by the IEEE but I am not sure why not as it has not been reissued which is supposed to happen for all active IEEE documents every five years.

IEEE P-1014

 6/26/1995 withdrawn
K. Clohessy
IEEE Standard for 32/64-bit Versatile Backplane Bus VMEbus. This PAR was withdrawn and is no longer endorsed by the IEEE. Kim Clohessy died in May 2006 after a battle with cancer. He is missed greatly by all who knew and worked with him on many IEEE and VITA standards. This work was completed within VITA's VSO and is ANSI VITA 1.0 American National Standard for VME64.

IEEE Std 1014.1-1994

 6/26/1995 withdrawn
W. Fischer
IEEE Standard for a Futurebus+ VME 64 Bridge. This standard was withdrawn by the IEEE on May 1, 2000.

IEEE Std 1096-1988

5/19/1989 withdrawn

S. PriTal

IEEE Standard for Multiplexed High-Performance Bus Structure VSB. This defined the Address lines AD00-AD31 on rows A and C. One of the first P2 VME buses. This standard was withdrawn by the IEEE on December 9, 1997.

IEEE Std 1101-1987

withdrawn

E. Waltz

IEEE Standard for Mechanical Core Specifications for Microprocessors. Withdrawn Standard. Withdrawn 12/21993. No longer endorsed by the IEEE. 

IEEE Std 1101.1-1998

9/28/1998

E. Waltz

Standard for Mechanical Core Specification for Microcomputers Using IEC 603-2 Connectors

IEEE Std 1101.2-1992

 6/18/1992

 Kim Clohessy

Standard for Conduction Cooled Eurocards. Mechanical characteristics of conduction-cooled versions of Eurocard subracks. The aim is to ensure mechanical compatibility of conduction-cooled rugged card assemblies with commercial 6U Eurocard subracks.

IEEE Std 1101.3-1992

withdrawn

K. Clohessy

IEEE Mechanical Standard for Conduction-Cooled and Air-Cooled 10 SU Modules. Withdrawn Standard. Withdrawn Date: Jan 15, 2001.  No longer endorsed by the IEEE.

IEEE Std 1101.4-1993

withdrawn

J.Toy

IEEE Standard for Military Module, Format E Form Factor. The mechanical design requirements for a military module, format E form factor are established. Withdrawn Standard. Withdrawn Date: Jan 15, 2001. No longer endorsed by the IEEE.

IEEE P-1101.8

withdrawn

A. Brough?

Mechanical Standard for Liquid-Flow-Through Cooled Modules, 10SU Form Factor. Create a new standard detailing liquid-flow-through module interface standards based 1101.3 including the liquid quick-disconnects, insertion levers, and other dimensional details.

IEEE Std 1101.10-1996

9/11/2002

E. Waltz

Additional Mechanical Specifications for Microcomputers Using the IEEE Std 1101.1-1991 Equipment Practice. This standard was reaffirmed in 2002.

IEEE Std 1101.11-1998

5/21/1998

E. Waltz

Mechanical Rear Plug-in Units Specifications for Microcomputers Using IEEE 1101.1 and IEEE 1101.10 Equipment Practice

IEEE Std 1149.1



Test access Port and Boundary-Scan Architecture - JTAG

IEEE Std 1149.4



Mixed-Signal Test Bus- JTAG

IEEE Std 1149.5 Revision 95

1995 withdrawn  


Standard Module Test and Maintenance (MTM) Bus Protocol- JTAG 

IEEE Std 1149.6



Boundary-Scan Testing of Advanced Digital Networks- JTAG

IEEE Std 1155-1992

stabilized

M. Miner

VXI on VME – This modular instrumentation bus is considered “stabilized” by the IEEE. It is still “sound” but there is no further standardization effort expected.

IEEE Std 1155 revision

Proposed Update

M. Stora

VXI on VME – This revision to the modular instrumentation bus is intended to update  IEEE 1155 with VITA 41.0 VXS

IEEE Std 1156.2-1996(R2003)

2003

R. Schubert

Environmental Specifications for Computer Systems such as IEEE 1014

IEEE Std 1175.2-draft 0.8

5/2007

C. A. Singer

Draft Recommended Practice for CASE Tool
Interconnection - Characterization of
Interconnections . This 46 page recommended practice is concerned with the interconnection with software tools not electrical connectors.

IEEE Std 1296

1984

 

Standard for Multibus II Microcomputers

IEEE Std 1301-1991

2001

D. Gustavson

Standard for Metric Equipment Practice for Microcomputers Coordination Document

IEEE Std 1301.1-1991

2001

D. Gustavson

Metric Equipment Practice for Microcomputers - Convection-Cooled with 2 mm Connectors

IEEE Std 1301.2-1993

2001

D. Gustavson

Recommended Practices for the Implementation of a Metric Equipment Practice

IEEE Std 1386-2001

10/25/2001

W. Fischer

Common Mezzanine Card Family: CMC

IEEE Std 1386.1-2001

10/25/2001

W. Fischer

Physical and Environmental Layers for PCI Mezzanine Cards: PMC

IEEE Std 1394-1995

8/30/1996 

G. Marzas

 IEEE Standard for a High-Performance Serial Bus (Firewire) This standard uses the IEEE 1212 Command and Status  Register (CSR) architecture. It is designed to be used between cards on the same backplane, cards on different backplanes or between cards and peripheral devices. It is used with 32 and 64 bit parallel busses, IEEE  1596,  and is  a popular as an interface to video  accessories since its adoption by Apple Corporation in 1995..  This specification was initially developed by Texas Instruments.

IEEE P-1394

12/ 11/2002

Bob Davis

 IEEE Standard for a High-Performance Serial Bus (Firewire) This PAR will incorporate IEEE 1394a-2000 and IEEE 1394b-2000 to and other developments that have been developed by the user community. For technical information on this activity bob@scsi.com

IEEE Std 1394.1-2004

7/1/2005 

P. Johansson

 IEEE Standard for High-Performance Serial Bus Bridges. This document defines a Firewire bridge in accordance with IEEE 1212 CSR s and incorporating the capability of IEEE 1394a-2000 and IEEEb-1394b-2000.

IEEE Std 1394.2

superseded 

Bill Van Loo

 IEEE Standard for Serial Express: A Scalable Gigabit Extension to the IEEE Standard Serial  Bus. This was intended to provide a gigabit link up to 25 meters. This document was renumbered to IEEE 2100 which was itself ultimately withdrawn sometime after 6/20/1996.

IEEE Std 1413.1

 


Reliability calculations for electronic hardware.

IEEE 1451

 


Standards for a smart transducer interface

IEEE P1451.0 


Protocols & Format 

IEEE 1451.1

1999


Information Model for smart transducers 

IEEE 1451.2 ECN in process

1997


Transducer to Microprocessor Communication Protocols and Transducer Electronic Data Sheet (TEDS) Formats 

IEEE 1451.3 Digital

1999


Communication and Transducer Electronic Data Sheet (TEDS) Formats for Distributed Multidrop 

IEEE 1451.4 



Mixed-mode Communication Protocols and Transducer Electronic Data Sheet (TEDS) Formats (Final approval process) 

IEEE 1451.5

 


Wireless Communication Protocols and TransducerElectronic Data Sheet (TEDS) Formats (Early approval process)

IEEE 1451.6 CAN

 



IEEE 1588-2002

2002

TC-9

A Precision Clock Synchronization Protocol for Networked Measurement and Control Systems

IEEE P-1693

3/30/2006

S. Mann
M. Stora

Modular Interconnect Packaging for Scalable Systems: VXI over VXS This is a very new effort to update the VXI standard with features taken from VXS, RFI, ViPAC Arrays, LRM Connectors

IEEE 2100

withdrawn 

Bill Van Loo

 IEEE Standard for Serial Express: A Scalable Gigabit Extension to the IEEE Standard Serial  Bus. This effort superseded IEEE P-1394.2 but has been subsequently withdrawn. See  IEEE 1394.2 for details. .





IBM-Intel BladeCenter Alliance



http://ibm.com/servers/eserver/bladecenter/alliance 

BSA eServerBladeCenter™

9/2004

S. Simon

The Open Specification and now has more than 215 partners who have signed on to receive the BladeCenter specifications to build and design their own products for the ecosystem, since IBM and Intel opened the hardware specifications for BladeCenter on September 2, 2004.

Base Specification includes documents for blades, switches, blade adapters, the SERDES midplane interface and Vital Product Data (VPD). The blade, switch and blade adapter specifications provide compliance requirements for the hardware and software interfaces, including mechanical form factors, connector pin outs, and electrical and thermal requirements.

The SERDES document is a design guide for electrical signals that travel over the high-speed SERDES lines on the midplane. 
The VPD document describes all of the fields and values that must be provided in VPD.

Currently, third parties must certify and perform interoperability testing of their blades, switches and adapters with IBM, Intel or one of our many OEMs. While this is not mandatory, most customers expect this testing be done. In the coming months, we will release a test specification to enable more independence for third parties. This is important to confirm that all components are good citizens in the blade chassis.

The test specification will encompass environmental power, thermal, noise, and emissions, as well as systems management interfaces.

BladeCenter Alliance partner program. 





IEC Standards

 


https://iec.ch 

IEC 60297-1-1982

1986

19 inch Racks

Dimensions of mechanical structures of the 482.6 mm (19 in) series. Part 1: Panels and racks

IEC 60297-2 1982

1982

19 inch Enclosures

Dimensions of mechanical structures of the 482.6 mm (19 in) series. Part 2: Cabinets and pitches of rack structures

IEC 60297-3 1984

1984

Eurocard Modules

Dimensions of mechanical structures of the 482.6 mm (19 in) series. Part 3: Subracks and associated plug-in units

IEC 60297-3-am1 1992

1992

Eurocard Subracks

Amendment 1 - Dimensions of mechanical structures of the 482.6 mm (19 in) series. Part 3: Subracks and associated plug-in units

IEC 60297-4-1999

1999

Eurocard Plug-in Modules

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 4: Subracks and associated plug-in units - Additional dimensions

IEC 60297-4-am1-1999

1999

 Dimensions for 19” racks

Amendment 1 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 4: Subracks and associated plug-in units - Additional dimensions

IEC 60297-5-100-2001

2001

Dimensions for 19” racks 

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-100: Subracks and associated plug-in units - Design overview

IEC 60297-5-101-2001

2001

Eurocard

Injector Handles

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-101: Subracks and associated plug-in units - Injector/extractor handle

IEC 60297-5-102-2001

2001

Enhanced Eurocard Subracks IEEE 1101.10

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-102: Subracks and associated plug-in units - Electromagnetic shielding provision

IEC 60297-5-103-2001

2001

Ground Pin

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-103: Subracks and associated plug-in units - Electrostatic discharge protection

IEC 60297-5-104-2001

2001

Keying

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-104: Subracks and associated plug-in units - Keying

IEC 60297-5-105-2001

2001

Alignment Pins

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-105: Subracks and associated plug-in units - Alignment and/or earth pin

IEC 60297-5-107-2001

2001

Rear Plug-in

Modules

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-107: Subracks and associated plug-in units - Rear-mounted plug-in units

IEC 60352-1-1997

1997

Wire Wrap

Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance

IEC 60352-2-1990

1990

Crimped Termination

Solderless connections. Part 2: Solderless crimped connections - General requirements, test methods and practical guidance

IEC 60352-2-am1-1996

1996

Crimped Termination Additional

Amendment 2 - Solderless connections. Part 2: Solderless crimped connections - General requirements, test methods and practical guidance

IEC 60352-3-1993

1993

IDC Termination

Solderless connections - Part 3: Solderless accessible insulation displacement connections - General requirements, test methods and practical guidance

IEC 60352-5-1993

1993

Pressfit Std

Amendment 1 - Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance

IEC 60352-5-am1-1993

1993

Pressfit Std Additional 

Amendment 1 - Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance

IEC 60469-1 1987

12/01/1987

Pulse Analysis Terms

This IEC standard covers the terms and definitions for the pulse analysis technique and apparatus. This is  Part 1-Second Edition 56 pages.

IEC 60469-2 1987

12/01/1987

Pulse Analysis 

This DIN-IEC standard addresses general coniserations, analysis, measurements and apparatus related to using the pulse technique. This  Part 2:-Second Edition 36 pages.

IEC 60529

 

 

Degrees of Protection provided by Enclosures

IEC 60603-2-am1-2000

2000

DIN 41612

Amendment 1 - Connectors for frequencies below 3 MHz for use with printed boards - Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features

IEC 60603-3-1987

1987

 Two Part with staggered spacing

Connectors for frequencies below 3 MHz for use with printed boards. Part 3: Two-part connectors for printed boards having contacts spaced at 2.54 mm (0.100 in) centers and staggered terminations at that same spacing

IEC 60603-4-1987

1987

 

Connectors for frequencies below 3 MHz for use with printed boards. Part 4: Two-part connectors for printed boards having contacts spaced at 1.91 mm (0.075 in) centers and staggered terminations at that same spacing

IEC 60603-5-1987

1987

 

Connectors for frequencies below 3 MHz for use with printed boards. Part 5: Edge-socket connectors and two-part connectors for double-sided printed boards with 2.54 mm (0.1 in) spacing

IEC 60603-6-1987

1987

 

Connectors for frequencies below 3 MHz for use with printed boards. Part 6: Edge socket connectors and printed board connectors with 2.54 mm (0.1 in) contact spacing for single or double sided printed boards of 1.6 mm (0.063 in) nominal thickness

IEC 60603-7-1996

1996

 

RJ Connectors for frequencies below 3 MHz for use with printed boards - Part 7: Detail specification for connectors, 8-way, including fixed and free connectors with common mating features, with assessed quality

IEC 60603-7-1-2002

2002

 

RJ Connectors for electronic equipment - Part 7-1: Detail specification for 8-way, shielded free and fixed connectors with common mating features, with assessed quality

IEC 60603-7-7-2002

2002

 

RJ Connectors for electronic equipment - Part 7-7: Detail specification for 8-way, shielded, free and fixed connectors, for data transmission with frequencies up to 600 MHz (category 7, shielded)

IEC 60603-8-1991

1991

 

Connectors for frequencies below 3 MHz for use with printed boards. Part 8: Two-part connectors for printed boards, for basic grid of 2.54 mm (0.1 in), with square male contacts of 0.63 mm x 0.63 mm

IEC 60603-9-1990

1990

 

Connectors for frequencies below 3 MHz for use with printed boards. Part 9: Two-part connectors for printed boards, backpanels and cable connectors, basic grid of 2.54 mm (0.1 in)

IEC 60603-10-1991

1991

 

Connectors for frequencies below 3 MHz for use with printed boards - Part 10: Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), inverted type

IEC 60603-11-1992

1992

 

Connectors for frequencies below 3 MHz for use with printed boards - Part 11: Detail specification for concentric connectors (dimensions for free connectors and fixed connectors)

IEC 60603-12-1992

1992

 

Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits

IEC 60603-13-1995

1995

 

Connectors for frequencies below 3 MHz for use with printed boards - Part 13: Detail specification for two-part connectors of assessed quality, for printed boards for basic grid of 2,54 mm (0,1 in), with free connectors for non-accessible insulation displacement terminations (ID)

IEC 60603-14-1998

1998

 

Connectors for frequencies below 3 MHz for use with printed boards - Part 14: Detail specification for circular connectors for low-frequency audio and video applications such as audio, video and audio-visual equipment

IEC 60603-4-2

 

 

Electromagnetic Compatibility (EMC) – Part 4-2 Testing and Measurements Techniques – Electrostatic Discharge Immunity Test Consolidated Edition, A1 & A2 Incorporated.  

IEC 60721-1 revision 2

10/2002


Classification of environmental conditions – Part 1: Environmental Parameters and their Severity's. 

IEC 60721-2-1 revision 2

10/2002


Classification of environmental conditions – Part 2-1: Environmental Conditions Appearing in Nature – Temperature and Humidity. 

IEC 60721-2-6 revision 90

12/1990


Classification of environmental conditions – Part 2: Environmental Conditions Appearing in Nature – Earthquake, Vibration and Shock. 

IEC 60721-3-0 Revision 02

4/987


Classification of environmental conditions – Part 3: Classification of Groups of Environmental Parameters and their Seventies – Introduction.

IEC 60721-3-1Revision 97

2/1997


Classification of environmental conditions – Part 3: Classification of Groups of Environmental Parameters and their Severities – Section 1: Storage.

IEC 60721-3-2 Revision 97

3/1997


Classification of environmental conditions – Part 3: Classification of Groups of Environmental Parameters and their Severities: Transportation. – 

IEC 60917-1 revision  98 ChgA1

5/2000

 

ENERIC STANDARD Modular order for the development of mechanical structures for electronic equipment practices – Part 1.

IEC 60917-2 revision  92

6/9/1992

 

Modular order for the development of mechanical structures for electronic equipment practices – Part 2: Sectional specification-interface- co-ordination dimensions for the 25 mm equipment practice.

IEC 60917-2-1revision 93

11/1993

 

Modular order for the development of mechanical structures for electronic equipment practices – Part 2: Sectional specifications interface co-ordination practice section 1: Detail specification dimensions for the 25 mm equipment practice section 1: Detail Specification dimensions for cabinets and.

IEC 60917-2-2 revision 94

4/1994

 

Sectional specification – interface co-ordination dimensions for the 25 mm equipment practice – section 2: Detail specifications for subracks chassis, backplanes, front panels and plug-in units. 

IEC 61076-4-100

10/2001

2.54 COMbus connector

Detail Specifications for two-part connector modules having a grid of 2.54 mm for printed boards and backplanes. Connectors for electronic equipment Part 4-100. This is the COMbus connector and is used in mid-plane applications. 

IEC 61076-4-101 2003-11

2003

2mm HM connectors

Detail specification for two-part connector modules, having a basic grid of 2,0 mm for printed boards and backplanes in accordance with IEC 60917

IEC 61076-4-104

3/1999

2mm FB connectors

Detail specification for two-part, modular connectors, and basic grid of 2.0 mm with terminations.  Connectors for use in D.C., low frequency analogue and digital high speed data applications – Part 4-104: printed board connectors. This is the 2mm connector popularly called the Futurebus connector. 

IEC 61076-4-113

11/2002

VME64x connector

Detail specifications for two-part connectors having 5 rows with a grid of 2.54 mm for printed boards and backplane in bus applications. This is the 5-row VME64x connector which is backward compatible with the IEC 603.2 commonly known the 3 row DIN connector.

IEC 61587-1 (1999-06)

 

 

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis

IEC 61587-3 (1999-10)

 

 

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks. Stipulated attenuation values are chosen for the definition of the shielding performance level of cabinets and subracks as per the IEC 60297 and IEC 60917.

 

 

 

 

 Military Standards

 

 

 http://global.ihs.com/standards.cfm  http://www.dtc.army.mil/publications/milstd.html

MIL-HDBK-454 Rev A

11/2000

 

General Guidelines for Electronic Equipment 

MIL-STD-167 Rev B

6/1993

 

Mechanical Vibrations of Shipboard Equipment Type CNCL S/S by MIL-STD 167-1, MIL-STD-167-2 

MIL-STD-461 Rev E EMI Emissions

8/1999

 

Requirements for the Control of Electromagnetic Interference Characteristics of Subsystems and Equipment. 

MIL-STD-704 Rev F Aircraft Power

3/2004

 

Aircraft, Electric Power Characteristics 

MIL-STD-810 Rev F Shock and Vibration

5/2003

 

Environmental Engineering Considerations and Laboratory Tests . MIL-STD 810 G is now in preparation.

MIL-STD-D-901Rev D Shock Tests, H.I. (High-Impact)

3/17/1989


Shock Tests, H.I. (High-Impact) Shipboard Machinery, Equipment & Systems, Requirements. This specification covers shock testing requirements for ship board machinery, equipment, systems, and structures, excluding submarine pressure hull penetrations.

MIL-STD-1275 Rev B  28 VDC

4/2004

 

Characteristic of 28 Volt DC Electrical Systems in Military Vehicles 

MIL-STD-1344 

10/22/04

 

Test Methods for Electrical Connectors - Superceeded by EIA 364

MIL-STD-1553B

1/1996

 

Digital Time Division Command / Response Multiplex Data Bus

MIL-STD-5400 Rev 92 Airborne Equip

11/1995

 

General Requirements for Airborne Electronic Equipment 

MIL-C-24308

4/1997

 

General Specification for Connectors, Electric, Rectangular, Non-Environmental, Miniature, Polarized Shell, Rack, and Panel

MIL-P-28809 Printed Wiring Assemblies



Printed Wiring Assemblies (Inspection Criteria for Conformally Coated Assemblies, U.S. DOD).

MIL-C-38999 Rev J

5/ 1993

 

Connectors, electrical, circular, high density, quick disconnect (bayonet, threaded, and breech coupling), environment resistant, removable crimp and hermetic solder contacts, general specifications for. 

MIL-C-38999/1

3/1985

 

Connectors, electrical circular, miniature, high-density, quick disconnect, environment resistant, removable crimp contacts, backshell, without strain relief 

MIL-C-38999/2

3/1985

 

Connectors, electrical high-density, quick disconnect, environment resistant, removable crimp contacts, backshell shrink boot. 

MIL-C-38999/3

3/1985

 

Connectors, electrical, circular, miniature, high-density, quick disconnect, environment resistant, removable crimp contacts, backshell, EMI crimp ring adapter, straight. 

MIL-C-38999/4

3/1985

 

Connectors, electrical circular, miniature, high-density, quick disconnect, environment resistant, removable crimp contacts, backshell, individual shield termination. 
MIL-I-46058C Insulating Compound

Insulating Compound, Electrical (Material Specification U.S. DOD) 
MIL-C-55302 Connectors
5/ 1992


Connectors, printed circuit subassembly: plug, insert (insulator), rectangular, polarized, removable crimp type, hermaphroditic contacts (0.100 inch spacing). 
MIL-E-6051D
2/1988


Electromagnetic Compatibility Requirements, Systems, Amendment 1, Interim, Notice 1 Validates AMD 1

UNDERWRITERS LABORATORIES



http://www.ul.com

UL-94V0 Flammability




UL-746C Polymeric Materials



Polymeric Materials ­ Use in Electrical Equipment Evaluations (Underwriters Laboratories recognition).
ANSI-UL-60950-1

4/1/2003


Information Technology Equipment Safety Part 1 - General Requirements. This 444 page document is based on IEC 60950-1 and is also available as CAN/CSA -C22.2. This covers voltage insulation and isolation for a variety of environmental conditions and voltage levels.

AIR FORCE MATERIEL COMMAND



 http://www.e-publishing.af.mil/

AFMC PAMPHLET 63-4

12/1998

Maj. D. Snyder

Acquisition: Modification Management -Commercial Off the Shelf

AFMC MANUAL 23

1/9/1998

R. Grzeskowiak

Supply: This manual sets up policies, procedures, and mission assignments pertinent to accomplishing materiel identification and standardization programs and projects. It applies to HQ Air Force Materiel Command (AFMC), the Air Force Cataloging and Standardization Center (CASC), and all Air Logistics Centers 

US Navy


http://www.nswc.navy.mil/wwwDL/B/OACE/
Open Architecture Computing Environment Design Guidance version 1.0
8/24/2004

This document provides Open Architecture (OA) design guidance for a family of extensible hardware and software standards.  This 122 page document advocates a shift from a platform centered approach to an integrated Battle Force centered approach.
Open Architecture (OA) Computing Environment Technologies and Standards version 1.0
8/23/2004

This 89 page document provides a core set of technologies and standards that apply to the Open Architecture Computing Environment (OACE) technology base.

Department of Defense Directive

 


http://www.dtic.mil 

DOD 4120.24-M OUSD

3/2000


DSP Policies & Procedures: OUSD Acquisition, Technology and Logistics. This Department of Defense Directive establishes the policies and procedures necessary to achieve the standardization objectives required by 10 U.S.C. 2451-2457, DoD Instruction 4120.24, DoD Directive 5000.1, and DoD 5000.2-R (references (a) through (d)).
DOD 4120.24-M OUSD Chap 3


3/2000


Chapter 3 from the Acquisition, Technology and Logistics directive ODSU. This chapter specifically  defines  Standardization in the Acquisition Process. For example, under the open systems initiative, equipment is not standardized, however, interface connections and information architecture is to be standardized where possible. The goal is to make it possible to upgrade equipment and keep pace with technology advances while at the same time allowing the most advanced customized internal componentry that can be developed for the application.

DOD Directive 5000.1


5/12/2003




To maximize competition, innovation, and interoperability, and to enable greater flexibility in capitalizing on commercial technologies to reduce costs, acquisition  managers shall consider and use performance- based strategies for acquiring and sustaining products and services whenever feasible. 

DOD Instruction  5000.2

5/12/2003


To achieve the best possible system solution, emphasis shall be placed on innovation and competition. Existing commercial-off-the-shelf (COTS) functionality and solutions drawn from a diversified range of large and small businesses
shall be considered.
RTCA Radio Technical Commission for Aeronautics


http://www.rtca.org
DO-178B
3/26/1999

This document supersedes DO-178A Software Considerations in Airborne Systems and Equipment Certification. This is document is recognized by the FAA as the accepted means of certifying all aviation hardware and software. This is a process document and covers document control, verification, and quality assurance record keeping.




ARINC(Aircraft Radio Incorporated)

 

, MD

http://www.arinc.com 

ARINC 404A

 

 

Air Transport Equipment Cases and Racking. Commonly referred to as ATR boxes or enclosures. ATR enclosures come in various sizes described by fractional relation to a standard size.

ARINC 429 Part 2

2/2/2004


Supplement 16 to ARINC Specification 429 Part 2

NC 600-13

 

 

Air Transport Avionics Equipment Interfaces

ARINC 607-3

 

 

Design Guidance for Avionics Equipment

ARINC Project  644

12/2003

R. Courtne

Project Paper 664:  Aircraft Data Network. Parts 3 and 4 mature others in process.                
 Part 1: Systems Concepts and Overview –reference model and scope of the ARINC 664 document suite.    
Part 2: Ethernet Physical & Data Link Layer Specification –
Fiber Optics Working Group.   
Part 3:
Internet-based Protocols & Services.
Part 4:
Internet-based Address Structure
& Assigned Numbers - Internet Protocol version 6 (IPv6) based on commercial Ethernet.                                            
  Part 5: Network Domain Characteristics and Functional Elements network management provisions.          
Part 7:
Deterministic Network: Avionics Full-duplex Switched Ethernet – Interoperation with Non-IP Protocols and Services

ARINC 728

 

 

Avionics Refrigeration Cooling System (ARCS)

IPC Association 

 

 

http://www.ipc.org 

IPC-HDBK-001 Amend. Y 3/1998

12/2000

 

Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies

IPC-TR-476A

5/1997

 

Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies

IPC-EM-Task Group 5-32e

2003

 

Electrochemical Migration: Conductive Anodic Failure Task Group

IPC-TM-650

 

 

IPC Test Methods Manual

IPC-6010

 

 

Qualification and Performance Series

IPC-6011

 

 

Generic Requirements for Printed Boards,
Regardless of Substrate

IPC-A-610B

 

 

Printed Circuit Assemblies

IPC-A-610C

Obsolete

 

Printed Circuit Assemblies

IPC-CC-830 Insulating Compounds 



Qualification and Performance of Electrical Insulating Compounds for Printed Board Assemblies.

Advanced Switching Special Interest Group

 

 

http://asi-sig.org 

TWG PI-2 Transport Services

11/2004

R. Kumar

The new PI-2 (Transport Services)  is a tunneling protocol for transporting arbitrary protocols across an ASI fabric. Acting as an intermediate protocol (or "shim"), PI-2 encapsulates a higher-level PI (Protocol Interface) in order to provide a set of optional transport services, and is further encapsulated with
optional PI-1 (Congestion Management), optional  PI-0 (multicast) and an ASI route header.

TWG ASI Core spec version 1.1

11/2004

R. Kumar

The ASI Core spec will incorporate Errata and ECRs (Engineering Change Requests) that have been submitted by ASI SIG member companies. Change highlights include: - - Device Class, Events, and Flow Control ECRs

Electronic Industries Association

 

 

http://www.eia.org 

RS  EIA  TIA


The EIA originally released their specifications as "Recommended Standards" hence the RS in RS232.

EIA-232D or RS232D

various
since 1962 (RS)

R. Kumal

The RS 232  was first introduced in 1962. It was probably implemented on the 25-pin D-subminiature connector that had been introduced already in 1952. This interface has been said to have been developed around 1962 by AT&T possibly for application in the Bell 103 modem. By 1969  Bell Laboratories worked to simply the implementation and it  was released as  RS 232C.  It  was revised  in 1987 as RS 232  D.  RS 232 is also equivalent to the following standards  CCITT V.24/V.28, X.20bis/X.21bis and ISO IS2110.The EIA used to designate all of the standards as "Recommended Standards" or RS but this practice has been discontinued. 

EIA-232F

1997


This is the current version of the RS-232 interface standard. IA-232-F "Interface Between Data Terminal Equipment and Data Circuit-Terminating Equipmment Employing Serial Binary Data Interchange.

EIA-28 Revision D

3/27/06


TP-28E Vibration Test Procedure for Electrical Connectors and Sockets

NSI-EIA-310-D-1992

9/1992

 

Cabinets, Racks, Panels and Associated Equipment

ANSI-EIA-364-1000.01-2000

1/2001

 

Environmental Test Methodology for Assessing the Performance of Electrical Connectors and Sockets Used in Business Office Applications

ANSI-EIA-368-108-2000

7/7/2000


Impedance, Reflection Coefficient, Return Loss, and VSWR Measured in the Time and Frequency Domain Test Procedure for Electrical Connectors, Cable Assemblies or Interconnection Systems

EIA-TIA 574

t.b.d.

R. Kumar

The RS 232  was first introduced in 1962.  I don't know the original connector implementation but by 1969  Bell Laboratories worked to simply the implementation and it  was released as  RS 232C.  It  was revised  in 1987 as RS 232  D.  On the 9-pin D-sub it is EIA-TIA 574 see EIA 232 above.

EIA-E700A-199X draft 0.6

11/1995


Custom Two-Part Connector for Printed Wiring Boards and Backplanes-Expanded DIN

VECI-E-100 an EIA participant



Encoder Industry Standard www.veci-vrci.com 

VRCI-P-100A Variable Electronic Components Institute an EIA participant

Precision potentiometer standard  www.veci-vrci.com

Government Electronic Industries Association

 

 

http://www.geia.org 

GEIA-STD-0005-1

2/25/2005

Performance Standard for Aerospace and Military Electronic Systems Containing Lead-free Solder. This document has been submitted to ANSI.

GEIA-STD-0005-2

12/19/2005

Controlling the Effects of Tin on Aerospace and Military Electronic Systems Containing Lead-free Solder. This document is in final ANSI ballot. The ballot closes 1/26/2006

GEIA-HB-0005-1

12/30/2005

Program Manager's Handbook for Managing the Transition to Lead-free Electronics in Aerospace and Military Systems The ballot for this document will end on 2/6/2006

GEIA-HB-0005-2



Technical Guidelines for Aerospace and Military Electronic Systems Containing Lead-free Solder.

INCITS Inter National Committee on Information Technology Standards



http://www.incits@itic.org 

ANSI-INCITS-370 ATA/ATAPI  Host Adapter Standard

2004


AT Attachment Host Adapter Standard.

ANSI-INCITS-397-2005 ATA/ATAPI-7 

2005


AT Attachment with Packet Interface.

ANSI-INCITS T10 SAM-SAM-3



Small Computer Storage Interface SCSI

ANSI-INCITS SAS 1.1 Serial Attached SCSI INCITS-417

2006


Serial Attached SCSI

ANSI-INCITS T10 MMC-MMC-5



Networking

ANSI-INCITS T10 RBC



Networking

ANSI-INCITS T10 SBC-SBC-2



Networking

ANSI-INCITS-305 SCSI-3 Enclosure Services

1998


SCSI-3 Enclosure Services (SES) Command Set

ANSI-INCITS-305-1998 AM1-2000 SCSI-3 Enclosure Services

2000


SCSI-3 Enclosure Services (SES) Command Set  Ammendment

ANSI-INCITS T10 SPC-SP-3



Networking

ANSI-INCITS T11.1 (X3T9.3)



HIPPI

ANSI-INCITS T11.2


Shelton Van Doorn

Physical variants  i.e. media, connector, transmitter & receiver requirements web  http://www.t11.org/index.htm

ANSI-INCITS T11.3



Interconnection schemes

ANSI-INCITS T11.4




ANSI-INCITS T11.5



Storage Network Management Interface (SM) – non transport specific

HSBI High Speed Backplane Interface (defunct became OIF PLL Initiative)



http://www.hsbi.org (defunct)

HSBI

abandoned

J.D’Ambrosia

A 10Gb/s backplane channel definition. This effort was turned over to the Optical Internetworking Forum where it became the basis for the Physical Link Layer Committee's electrical specification for an interconnect channel. This same work became part of an open standards activity as part of the UXPi effort.

OBSAI Open Base Station Architecture Initiative



http://www.obsai.org 

RP3_V4.1

7/14/2007

Peter Kenington

The Reference Point 3 Specification is a 144 page document that includes the electrical specifications of the RP3 interconnect region of the OBSAI architecture. This region includes the meshed RF interconnects between the base board modules and the RF modules. Compliance is defined for links at 768, 1536, 3072, and 6144 MBaud. The 6.1 GBaud requirements are based upon the OIF-CEI-02.0 [14] Interoperability Agreement with its  section 7 and related clauses and the Serial RapidIO v2 PHY specifications 
Appendix G Conformance Test Cases for RP3 interface v4.0

7/3/2007

Peter Kenington

The Appendix G Conformance Test Cases for RP3 interface specification is a 98 page document that defines the compliance test procedures for the 6.1 GBaud RP3 link. defined in the OBSAI RP3_V4.1 document.








OIF Optical Internetworking Forum



http://www.oiforum.com

OIF-CEI-02.0
2/28/2005
interim release
M. Lerer
Common Electrical I/O (CEI) Electrical and Jitter Interoperability agreements for 6G+ bps and 11G+ bps I/O This 180 page document is the cumulation of several earlier efforts including HSBI and represents the efforts of 120 participating companies.. This interim document  is intended to have additional clauses added that are not yet completed.  This "Agreement" defines an agreed channel model and such characteristics as DC balance, transition density, maximum physical length and compliance parameters.  The CEI document is protocol agnostic.
SFI-4

SFI-4  This is an OC-192 SERDES-Framer Interface. This interface is between SONET and a SERDES. System Packet Interface Level 4 (SPI-4) Phase 2: OC-192 System Interface
SFI-5

SFI-5 SERDES Framer Interface Level 5 Implementation Agreement for 40Gb/s
SPI-3

SPI-3 System Packet Interface Level 3 (SPI-3): OC-48  
SPI-4

SPI-4 This System Packet Interface Level 4 ,Phase 2: OC-192 System Interface
SPI-4.1

SPI-4.1 System Interface Level 4 Phase 1: 10Gbps (OC-192) Peer-to-Peer using 64 data signals at 200 MHz
SPI-4.2

SPI-4.2 Physical Link Layer Interface that 16 bi-directional lanes at 622 Mbps or fast
SPI-5

SPI-5 System Packet Interface Level 5 : OC-768 System Interface

SXI-5


M. Lerer

SxI-5 of the Physical Layer Committee of the OIF Common Electrical Specification for a 10Gb/s electrical channel.

UXPi Unified 10Gbps Physical-layer Initiative an independent program of the IEEE-ISTO (Industrial Standards and Technology Organization)



http://uxpi.org 

UXPi Technical Specification revision 1.4

2003

B. Seeman

10 Gigabit/s channel definition.

Serial ATA International Organization



http://www.sata-io.org

High Speed Serialized AT Attachment Serial ATA Revision 2.5

10/27/2005


This 587 page document defines the Serialized AT Attachment interface.  This serial standard is designed in a register compatible scheme that allows backward compatibility with earlier parallel AT interfaces.  This current document defines a low pin count, low voltage interface and defines 1.5 Gbps and 3.0 Gbps implementations.

High Speed Serialized AT Attachment Serial ATA Revision 2.6

2/15/2007


This 600 page document defines the Serialized AT Attachment interface.  This serial standard is designed in a register compatible scheme that allows backward compatibility with earlier parallel AT interfaces.  This current document defines a low pin count, low voltage interface as well as other components including connectors and port expansion devices. 1.5 Gbps and 3.0 Gbps implementations are fully defined..





SFF Small Form Factor Committee 



http://www.sffcommittee.org/ns/  

SASI

1979


Shugart Associates Systems Interface first published as a 20 page document in 1979 became ANSI X3T9.2in 1982

SCSI-HA



Added ATN signals to create message protocol and this lead to CCS Common Command Set still used today.

SCSI-1

1986


Became ANSI X3.131 in 1986

 SCSI-2

1988


CDROM Commands

SCSI-3

1995


Ultra SCSI This proposal included Fiber Channel, Serial Packet Protocol or IEEE P-1394

SFF-8410

 

B. Ham

SFF-8410 HSS testing

SFF-8414
10/6/2005
G. McSorley
SFF-8414 Measurement of S-Parameters is the
main near term focus. This work dovetails nicely with the MSQS and FCSM-2 work in T11.2. This work will allow other work to move ahead

SFF-8415 revision 01

 

B. Ham

SFF-8415 The HPEI cable assembly project, will continue after SFF-8414 is technically stable.

SFF-8416 revision 01

 

B. Ham

SFF-8416 HPEI media

INF-8053
9/25/2000
R. Snively
Specification for GBIC (Gigabit Interface Converter)




SGMII


www.xilinx.com/bvdocs/ipcenter/data_sheet/gig_eth_pcs_pma_gs_ug145.pdf
SGMII or Ethernet 1000BASE-X PCS/PMA


The Serial Gigabit Media Independent Interface seems to be a specification developed by Xilinx, Altera and Cisco and like XAUI is a serial data architecture in the multi-gigabit region. Also known as Ethernet 1000BASE-X PCS/PMA
Ethernet Alliance


http://www.ethernetalliance.org

XAUI Version 1.0-2002

3/2002

J. D'Ambrosia

The XAUI interface was developed by the 10Gigabit Ethernet Alliance and distributed as a white paper. The "AUI" comes from the IEEE 802.3 Ethernet Attachment  Unit Interface and XAUI is a full duplex interconnect implemented as 4 self clocked serial lines operating at 3.125 Gb/s utilizing 8B/10B encoding. The University of New Hampshire (UNH IOH) provides compliance certification to the XAUI requirements. XAUI was adopted by IEEE 802.3ae in 2002 for the 10 Gigabit Ethernet physical layer .

Telecommunications Industry Association

 

 

http://www.tiaonline.org 

TIA Joint Communications Assistance for Law Enforcement Act a.k.a. FBI-Carnivore 
8/1999
12/17/2003
FBI-ERF
Homeland Security
White House
Carnivore is a packet "sniffer" that the FBI's Engineering Research Facility (ERF) in Quantico, Va. developed to covertly search for e-mails and other computer messages from criminal suspects. The program usually  sits in an ISP's facilities, monitoring all packets going through a particular router or pipe. It was developed by the FBI's ERF in 1999.  On December 17, 2003, at the White House, U.S. President Bush signed two new Homeland Security Presidential, Critical Infrastructure Identification, Prioritization, and Protection

TIA-366

1/1/2000
superseded

 

Interface Between Data Terminal Equipment and Automatic Calling Equipment for Data Communication (superseded by EIA-366-A)

TIA-366-A

3/1/1979
withdrawn

 

Interface Between Data Terminal Equipment and Automatic Calling Equipment for Data Communication (withdrawn May 1998).

ANSI/TIA/EIA-568-B.1-2-2003

2/27/2003

 

Commercial Building T elecommunications Cabling Standard - Part 1: General Requirements - Addendum 2 - Grounding and Bonding Requirements for Screened Balanced Twisted-Pair Horizontal Cabling.

ANSI/TIA-568-B.2-6-2003

12/1/2003

 

Commercial Building Telecommunications Cabling Standard - Part 2: Balanced Twisted Pair Cabling Components - Addendum 6 - Category 6 Related Component Test Procedures 

JEDEC Solid State Technology Association (former Joint Electron Device Engineering Council)



http://www.jedec.org

JESD 51-2



JESD 51-2 is the natural-convection standard, requiring that a box cover the test enclosure if room temperatures shift more than 3°C. It provides a measurement of junction to ambient thermal resistance (RèJA) that you can use as a comparison with the results of cooling methods.

ESD 51-6



JESD 51-6 is a forced-convection test performed in a wind tunnel with uniform airflow. You take RèJA measurements at 1m/sec and 2m/sec air speeds to measure the cooling effects of controlled convection on a device under test.

JESD 51-8



JESD 51-8 is the junction-to-board environmental standard
that provides RèJB data under defined conditions, including the use of cold plates to draw heat laterally into the board, and setting gap lengths to  separate the package from the cold plate and insulation. It also stipulates the temperature range of the cooling fluid at –5 to +2°C.

European Telecommunication Standards Institute

 

 

http://www.etsi.org 

ETSI TR 100 035 Revision 04

2/00/2004


Environmental Engineering (EE); Environmental  engineering guidance and terminology. 

ETSI TR 102 489 Revision 04

6/00/2004


Environmental Engineering (EE); European telecommunication standard for equipment practice; Thermal management guidance for equipment and its deployment.

ETSI EN 300 019-1-0 V2.1.2 (2003-09)



Environmental Engineering (EE); Environmental conditions and environmental tests for telecommunications equipment; Part 1-0: Classification of environmental conditions; Introduction

ETSI EN 300 019-1-2 V2.1.4 (2003-04)



Environmental Engineering (EE); Environmental conditions and environmental tests for telecommunications equipment; Part 1-2: Classification of environmental conditions;  Transportation

ETSI EN 300 019-1-3 V2.2.2 (2004-07)



Environmental Engineering (EE); Environmental  conditions and environmental tests for telecommunications equipment; Part 1-3: Classification of environmental conditions; Stationary use at weather protected locations

ETSI EN 300 019-1-4 V2.1.2 (2003-04)



Environmental Engineering (EE); Environmental conditions and environmental tests for telecommunications equipment; Part 1-4: Classification of environmental conditions; Stationary use at non-weather protected locations

ETSI EN 300 019-1-8 V2.1.2 (2002-04)



Environmental Engineering (EE); Environmental conditions and environmental tests for telecommunications equipment; Part 1-8: Classification of environmental conditions; Stationary use at underground locations

ETSI EN 300 019-2-0 V2.1.2 (2003-09)



Environmental Engineering (EE); Environmental conditions and environmental tests for telecommunications equipment; Part 2-0: Specification of environmental tests; Introduction

ETSI-EN-300 019-2-1 V2.1.2 (2000-09)



Environmental Engineering (EE); Environmental conditions and environmental tests for telecommunication equipment; Part 2-1 Specifications of Environmental Tests: Storage.

ETSI-EN-300 019-2-3 V2.2.2 (2003-04)


 

Environmental Engineering (EE); Environmental conditions and environmental tests for telecommunication equipment; Part 2-3: Specification of Environmental Tests; stationary use at weather protected locations. 

ETSI EN 300 019-2-4 V2.1.2 (1999-09)



Equipment Engineering (EE); Environmental conditions and environmental tests for telecommunications equipment; Part 2-4: Specification of Environmental Tests; Stationary use at non-weather protected locations

ETSI-EN-300 119-1 revision 04 draft

5/2004

 

Environmental Engineering (EE); European Telecommunication Standard for equipment practice; Part 1: Introduction and terminology.

ETSI-EN-300 119-2 revision 04 draft

5/2004

 

Environmental Engineering (EE); European Telecommunication Standard for equipment practice; Part 1: Introduction and terminology Part 2: Engineering requirements  for racks and cabinets. 

ETSI-EN-300 119-3 revision 04 draft

5/2004

 

Environmental Engineering (EE); European Telecommunication Standard for equipment practice; Part 1: Introduction and terminology Part 3: Engineering requirements for  miscellaneous racks and 

ETSI-EN-300 119-4 revision 04 draft

5/2004

 

Environmental Engineering (EE); European Telecommunication Standard for equipment practice; Part 4: Engineering requirements for subracks in miscellaneous racks and cabinets. 

ETSI-EN-300 119-5 V1.2.1 (2004-05) draft

5/2004

 

Environmental Engineering (EE); European telecommunication standard for equipment practice; Part 5: Thermal management.

ETSI-EN-300 386 V1.3.3 2005-04
Electromagnetic compatibility and Radio spectrum Matters (ERM); Telecommunication network equipment; Electro Magnetic Compatibility (EMC) requirements.

ETSI EN-300 753 ed.1

1997


 Acoustic noise emitted by telecommunications equipment

Telecordia Technologies, Inc. - SAIC 

 

 

http://www.telecordia.com 

GR 63 CORE Revision 12

4/00/2002


NEBS ™ Requirements: Physical protection (A module of LSSGR FR-64; TSGR, FR-440; and NEBSFR, FR-2063)** Also see GR-151-CORE**

R 78 CORE Revision 1

9/1997

 

Generic requirements for the physical design and manufacture of telecommunication products and equipment 

GR 357 CORE Issue 1

3/2001

 

Generic Requirements for Assuring the Reliability of Components Used in Telecommunications Equipment

GR 487 7


 

in process of adding this listing - environmental

GR 1089 CORE Issue 2 with Revision 1

2/1999

 

Electromagnetic Compatibility and Electrical Safety - Generic Criteria for Network Telecommunications Equipment

GR 1217-  Level I - Central Office or Uncontrolled Environment – revision 1

11/ 1995

 

Generic requirements for separable electrical connectors used in telecommunications hardware. Commercial grade with a vendor
controlled qualification process.

GR 1217 - Level II -  Central Office or Uncontrolled Environment – revision 1

11/1995

 

Generic requirements for separable electrical connectors used in telecommunications hardware. POTS grade, tested for less than 1 in 1,000 failures over a 10 year life. Requalified  every 5 years.

GR 1217 - Level III - Central Office or Uncontrolled Environment – revision 1

11/1995

 

Generic requirements for separable electrical connectors used in telecommunications hardware. POTS grade, tested for less than 1 in 10,000 failures over a 25 year life. Requalified every 3 years.

International Standards Organization

 

 

ttp://www.iso.org  

ISO/IEC Directives, Part 2 4th Edition

2001

 

Rules for the structure and drafting of International Standards including intellectual property issues.

ISO 1032
1999

Method for the measurement of airborne noise emitted by small air-moving devices
ISO 7779

1999

Measurement of airborne noise emitted by information technology and telecommunications equipment. 61 pages

ISO 9001:1994(E)

 

 

Quality systems - Model for quality assurance in design, development, production, installation and servicing

ISO 9002

 

 

Quality systems - Model for quality assurance in production, installation and servicing

ISO 9003)

 

 

Quality systems - Model for quality assurance in installation and servicing

ISO/IEC 11801:2002

2002 

JTC 1/SC 25

 Generic cabling for customer premises. I believe that this document defines CAT5 cabling.

ANSI American National Standards Institute

 

 

http://www.ansi.org 

ANSI S12.11-2003 Part 1
2003

Acoustics - Measurement of Noise and Vibration of Small Air-Moving Devices, Part 1: Airborne noise Emission. Equivalent to ISO 1030-2

ANSI Y14.100 Revision 98

 

 

Engineering Drawing Practices 

ANSI Y14.5M Dimensioning and Tolerancing

1984


This standard establishes uniform practices for stating and interpreting dimensioning, tolerancing, and related requirements for use on engineering drawings and in related documents.

ANSI Y14.5.1M

 

 

Mathematical Definition of Dimensioning and Tolerancing Principles.

ANSI Y14.5.2

 

 

Certification of Geometric Dimensioning and Tolerance Professionals 

ANSI Y14.5M Revision 94

 

 

Dimensioning and Tolerancing Principals

ANSI ASQ Z1.4

 

 

Sampling Procedures and Tables for Inspection by Attributes 

ASTM American Standards for Testing and Measurement




E 1594-99 



Standard Guide for the Expression of Temperature

Alliance for Telecommunications Industry Solutions 


 

http://www.atis.org 

 ANSI ATIS T1.304-1997

1997 

 

T1.304-1997 – Ambient Temperature and Humidity Requirements for Network Equipment in Controlled Environments

ANSI ATIS T1.336-2003 Engineering Requirements for a Universal Telecom Framework

10/22/2003

R. Townsend

Engineering Requirements for a Universal Telecom Framework – Includes basic dimensions for 23”, ETSI and 19” subrack standards  and 600 mm rack and floor planning dimensions.

ANSI ATIS T1.524-2004

2004

R. Townsend

This standard establishes consistent reliability-related metrics, features, and terminology for communication networks .

NSI ATIS T1E1.7

2003

R. Townsend

Document T1E1.7 Requirements for Maximum Voltage, Current, and Power Levels in Network Powered Transport Systems,
 
superseding a similar document, T1.TRQ.5 .

ANSI ATIS T1E1.7draft

ballot

R. Townsend

TR on Electrical Protection standards issue 64. Technical Report for Electrical Protective Standards  and Reference Documents Associated with Telecommunications Networks.

ANSI ATIS T1E1.7draft

ballot

R. Townsend

TR on Testing of Telecommunications Equipment issue 65. Requirements for Testing of Telecommunications Equipment
(complementary to part of UL-60950). 

ANSI ATIS T1E1.8

2003

R. Townsend

Physical Protection and Design document “Universal Telecom Framework” standard for Common Physical Systems Requirements for central office equipment. The Thermal protection  requirements for network equipment

ANSI ATIS NIPP-NPP Project 41

200X


“Thermal Protection Requirements for Network Equipment” is being prepared by the Network Physical Protection subcommittee of the NIPP. This is effort is issue 68. The NIPP-NPP was formerly the T1E1.8 committee.

SCOPE Alliance


http://www.scope-alliance.org




RSC Reconfigurable  Scaleable Computer


http://www.physorg.com/news4628.html
RSC Mechanicals


The Reconfigurable Scaleable Computer is a product that is being developed by NASA Langley in conjunction with the University of Queensland in Brisbane Australia. It is a stackable mezzanine 130 mm x 110 mm which can be stacked.
RSC Linux


A secure reusable Linux port for the RSC computer.












Multi Source Agreement


http://www.schelto.com/SFP/SFP%20MSA%20091400.htm
SFP
2000 see list of companies in description
The Small Form Factor Pluggable Transceivers is defined by the Multi-Source-Agreement signed by Agilent Technologies, Blaze Network Products, E2O Communications, Inc.,
ExceLight Communications, Finisar Corporation, Fujikura Technology America Corp.,
Hitachi Cable, Infineon Technologies Corp., IBM Corp., Lucent Technologies, Molex, Inc., Optical Communication Products, Inc., Picolight, Inc.,  Stratos Lightwave, Tyco Electronics over a period from September 2000 through November 2000. This agreement defined the mechanical and electrical design of a pluggable optical transceiver based on the GBIC module.





StatEye


http://www.stateye.org








Storage Bridge Bay


http://www.sbbwg.org/home
SBB JBOD  no draft yet

TBD
Just A Bunch Of Disks - This Storage Bridge Bay document will define the mechanical and electrical interface specifications and a controller card for various protocols. First announced on March 6, 2006 no draft documents are available at this time.
SSB RAID no draft yet

TBD
Redundant Array  of Inexpensive Disks-This Storage Bridge Bay document will define the mechanical and electrical interface specifications and a controller card for various protocols. First announced on March 6, 2006 no draft documents are available at this time.
SSB iSCSI no draft yet

TBD
Small Computer Systems Interface-This Storage Bridge Bay document will define the mechanical and electrical interface specifications and a controller card for various protocols. First announced on March 6, 2006 no draft documents are available at this time.
SSB Fibre Channel SAN no draft yet

TBD
Fibre Channel Storage Area Networks-This Storage Bridge Bay document will define the mechanical and electrical interface specifications and a controller card for various protocols. First announced on March 6, 2006 no draft documents are available at this time.
SSB NAS no draft yet

TBD
Network Attached Storage-This Storage Bridge Bay document will define the mechanical and electrical interface specifications and a controller card for various protocols. First announced on March 6, 2006 no draft documents are available at this time.
 ECMA


http: / /www.ecma.ch
ECMA-109 4th edition
12/1996

Declared Noise Emission Values of Information Technology and Telecommunications Equipment




CC-Link


www.cclinkamerica.org
CC-Link
2005/06?

CC-Link is an open, multidrop, deterministic, device-level network running at 10 Mbps that can operate over 100 meters of cable at 10 Mbps or as far as 13.2 km at slower speeds. The protocol is master-slave (with provisions for a standby master), connecting up to 8192 sensors and actuators on a single network with a typical update time of 4 ms. CC-Link is developed and maintained by the CC-Link Partner Association, with over 700 members.




Philips Semiconductor

 


http://www.philips.com/i2clogic 

I2C Bus Specification Version 2.1

1/2000


Developed by Philips in the early 1980s, this two-wire bus with a software-defined protocol has evolved to become the de facto worldwide standard for system control. The Inter-IC bus, commonly known as the I²C  ("eye-squared-see") bus, is a control bus that provides the communications link between integrated circuits in a system. It can be used for temperature sensors and voltage level translators as well as EEPROMs, general-purpose I/O, A/D and D/A converters and other devices including CODECs, and microprocessors of all kinds.

12C Logic Selection Guide



This Phillips Semiconductor document describes the various  semiconductor solutions for implementing the I2C bus. Two lines connect all the ICs in a system. Any I2C device can be attached to a common I2C-bus, and any master device can exchange information with any slave device. The software-controlled addressing scheme eliminates the need for address-decoding
hardware, and there's no need to design and debug external control logic because it's already provided by the IOC protocol.





 USB IF - Universal Serial Bus Implementors Forum



http://www.usb.org

USB 2.0 Spec. Rev 1.2
4/4/2006

USB Universal Serial Bus 2.0 - "On the Go" The original USB 2.0 was released 4/27/2000. The original USB 1.0 was released in 1995.








Basic Stamp Specification



            


Track Changes

 
Number
change                                                                                             Rev. Date      
Released
history
This document was first published on August 31, 1999 as StandardsList.pdf and  Computer Standards Summary A. These were based on a series charts that I had been creating for the previous several years such as Technology Summary, cPCI Summary, cPCI2.pfd and I-OTechnologies.pfd later it became just "StandardsList.html" and was identified as a document in the "open source tradition.  In 2005 inspired by "Revolution OS" I updated and re-introduced this list as a defined open source document in accordance with the GNU Free Documentation License. michael munroe

8/31/1999
0
add  table of changes below main table
15 Sept
9/15/05
00
add T1.524-2004 to ATIS section environmental
15 Sept
9/15/05
01
correct spelling  VITA 41.11-2005 draft 0.6.6 "W. Dennen"
26 Sept
9/26/05
02
updates to MicroTCA .0,
15 Sept
9/15/05
03
Added "RJ" to IEC 60603-7 series of connectors
26 Sept
9/26/05
04
minor formatting
26 Sept
9/30/05
05
Added ISO/IEC 11801:2002  I believe this is CAT5 cabling
26 Sept
9/30/05
06
Added description to VITA 42, 52 and 53. Up rev for VITA 42.0/.3 46.1/.3 48.0/.1/.2
30 Sept
9/30/05
07
Revised upward MicroTCA, VITA 46.0, and VITA 48.1
12 Oct
10/12/05
08
Fixed the release date
12 Oct
10/12/05
09
Added detail to ANSI-INCITS T11.2 and IEEEP802.3ap and "CTL F" 18 Oct
11/3/05
10
Added VITA 56, PICMG 3.6, IEEE 802.3ap Updated 46.0, 46.1, 46.3, 46.10,  48.0, 48.2, PICMG 3.0 ECN, PICMG 3.5, AMC .2, AMC .3, AMC .4 PICMG 1.3 SHB Express,DFP .0, SFP.1, COM 0  Corrected PICMG 1.2, 3.
11/3/05
11/3/05
11
Added SFF-8414, ETSI 300-386, ETSI 753, ISO 7779, ISO 1032, ANSI S12.11, ECMA 109,       Updated microTCA,17.2, 42.0, 42.10,  46.0, 46.1, 47, 48.1, 48.3, 51.0, 51.1, 54.0, 54.1, 54.2, 56.0, 56.1, 56.2, 56.4, 56.10, 20, 57 and ATCA300.
12/12/05
12/12/05
12
Updated PICMG MicroTCA, VITA41.11, 46.0, 46.1, 48.0, 48.1, 48.2, and 48.3. Changed ERDI to REDI and corrected spelling of M. Gust. Added VITA 51.1, 52.1, 52.2.  Added GEIA-STD-0005-1, GEIA-STD-0005-2, GEIA-HB-0005-1, GEIA-HB-0005-2. Updated 53, 56 and 57.0. Added 57.1, 57.2, and LRU WG. Added the new PICMG WG Requirements Engineering.
1/19/06
1/19/06
13
 Indicated that T. Lavely is retired, Updated VITA 41.10
1/30/06 not released
14
Corrected 41.5  and 41.50 and 41.7
1/23/06
3/6/06
15
Added SCOPE and CP-TA
2/1/06
3/6/06
16
Updated VITA 42.3, 46.0, 48.0, 55.0, 56.0, microTCA and added the Agilent LXI specification
3/6/06
3/6/06
17
Added  16 Rapid IO Trade Association documents, Added ATR to ARINC section to ease searching, eliminated redundant column in change table.
3/14/06

18
Many errors corrected in PXI Alliance chart of specifications. PXI-5 R1 ECN 1 is added
3/14/06
3/14/06
19
VITA 58 gains status as WG
3/1706
interim
20
VITA 46.0, 46.3, and 46.4 were updated. 46.10, 46.11, 46.x, 46.y were marked inactive. VITA 41.10 was marked as a trial use standard. VITA 56.0 also incremented its document.
4/3/06
4/3/06
21
Added RSC Computers and Storage Bridge Bay sections and index. Alphabetized Table of  Contents, US Navy OACE, Open Architecture Computing,
4/4/06
interim
22
Updated PICMG RES, microTCA, VITA 41.4, 46.0, 46.1, 46.5, 48.0, 55, 56.0,  IEEE P-1693, EPIC-express, PC/104, PC/104 Plus, EBX, EPIC, SPACE 104, and RTCA DO 178B
5/10/06
5/10/06
23
Updated PICMG ATCA300,  PICMG 3.0 R2.0 ECR002, PICMG AMC.0, AMC.4 PICMG uTCA, VITA 17.2, 41.7, 41.X, 46.4  48.1, IEEE 802.3an, IEEE 802.3ap, IEEE 1693 Added VITA 46.20 , IEEE 1175.2
5/23/2006
5/23/2006
24
Added the obsolete IEEE 181-1977 and IEEE 194-1977. Added IEEE 181-2003, IEC 60469-1, IEC 60469-2
5/25/2006
5/25/2006
25
Added "history" to this revision table. Updated IEEE 896.1, IEEE 1014, IEEE 1394-1995 and added IEEE 896.2, IEEE 1014.1, IEEE -1394, IEEE 1394.1, IEEE 1394.2 and IEEE 2100. Added also USB IF and USB 2.0
5/30/2006
6/7/2006
26
Updated VITA 41.6, 41.7, 46.0, 46.1, 46.3, 46.4, 46.20, 53.0, 54 series and 57.. PICMG ATCA R2ECR001, AMC 0 ECR001/002, microTCA and Interconnect Channel Characterization
6/6/2006
6/7/2006
27
Updated VITA 41.6,
6/21/2006
6/16/2006
28
Updated PICMG 2.9, AMC.0, AMC .0 ECN001,  AMC .0 ECN002, microTCA, ICCC, RES as well as  VITA 41.3, 41.11, 49.0, and 46.0 added SGMII
7/15/2006
7/15/2006
28
Corrected a lot of spelling errors. Added dates to PCI-X 1.0, PCI-X 2.0, moved yahoo.group information. Updated 41.11, 48.2, 56.0,  57.1, 58 and PICMG AMC 0 ECN002,  PICCC and  IEEE 802.3ap
7/27/2006
7/27/2006
29
Added CC-Link, updated VITA 41.0, 41.6, 41.7,46.2, 46.5, 46.8, 47, 56.0, and 56.1
8/17/2006
8/21/2006
30
Added VITA 37 -PIRMA for historical completeness, Update 20-R2005, 23-R2004, 26-R2003, 30.2 IEC, 31.2 2006, 41.0, 41.1, 41.2, 42.0, 42.1, 42.2, 42.3,  47-2005
8/22/2006
8/22/2006
31
Updated Mil Std 810, VITA 17.2, 41.6, 46.0, 46.9, 46.10, 46.20 PICMG AMC.2, PICMG 3.0 ECN 002, PICMG ICC and PICMG uTCA
10/3/2006
10/3/2006
32
Added RS 232D, RS232F, EIA TIA 574, EIA 232D, and comment on RS vs. EIA,
10/11/2006

33
Updated VITA 41.6,  46.0, 46.1, 46.9,45, 55.0, 55.1 and VITA57.1  Corrected 42.1. Updated PICMG AMC .0 R2.0, as well as added individual chapters for ATCA300.  Added PICMG HPM.1
12/8/2006
12/8/2006
34
 Updated IEEE P802.1ag, 802.3EEF, 802.3-2005,  P802.3Cor1, 802.3ae, 802.3af, 802.3ah, P802.3EVam, P802.3an, P802.3ap, P802.3aq, P802.3as Updated PICMG ICCC 1.b,  Added XAUI
12/18/2006

35
Updated  PICMG Com Exp ECR001/002, VITA 41.7, 46.10, 46.z, 47-R1-2005, 48.1, 48.2, 51 CoP,  53, 56.0, 56.1, 56.20, and 57.1
1/17/2006

36
Updated VITA 41.6, 41.7, 41.9, 42.0, 46.0, 46.9, 47r1, and PICMG AMC.1, AMC.2, ATCA300, ICCC, uTCAr,  HPM.1,  ASI Core, ASI Portal, ASI SQP, ASI PI-8, ASI STD, ASI SLS and IEEE 802.3ap
3/6/2007
3/6/2007
37
Added  ANSI-UL 60950-1, IEEE 802.3ap, IEEE 100GEthernet Study Group; Updated VITA 30.1, 41.6,  42.0, 42.4, 42.5, 46.0, 46.1, 46.3, 46.9, 46.10, 46.11 , 48.0, 48.1, 48.2, 48.4, 48.5 Serial ATA International Organization: Serial ATA 2.5, Serial ATA 2.6  INCITS ANSI-INCITS-370 ATA/ATAPI , ANSI-INCITS-397-2005 ATA/ATAPI-7 , SAS 1.1 SCSI INCITS-417, ANSI-INCITS-305 SCSI-3 Enclosure Services,  ANSI-INCITS-305-1998 AM1-2000 SCSI-3 Enclosure Services 7/18/2007
8/12/2007
38
Changes to ATCA 300, VITA 41.6, VITA 46.0, VITA 46.4, VITA 47.1,VITA 51.0, VITA 51.1, and VITA 56.0/.1/.2/.3/.4/.10/.20
9/7/2007
9/7/2007
39
Correction to  PICMG AMC 0.3 Updates to PICMG MicroTCA Rugged .1 Air,  VITA 46.0 , 46.1, 46.6, 46.7, 46.x, 46.y, 46.z, 46.20.
9/11/07
9/14/2007
40
Changes to VITA 46.1, 46..7, 46.9, 46.12 and  PICMG 3.0 ECR, ATCA300,  PICCC,  RES
9/18/2007
9/27/2007
41
PICMG AMC (corrections) ATCA300, PICCC, HPM.1 and VITA 41.6,  VITA 46.0, VITA 46.1, 41.6, VITA 46.0, 46.1, 46.7, 46.12, 47, 48.0, 48.1, 48.2,
11/5/2007
11/5/2007
42
EIA added 364-28 d, MIL STD 1344
11/13/007

43
Updates to VITA 46.4, 46.7, 46.12, 48.3, 57.1 and 58. PICMG  ATCA Zone 3.
1/8/2008
1/8/2008
44
Updates to VITA 40, 41.6, 46.4, 46.6, 46.7, 46.9, 46.10, 46.11. 46.12, 46.14, 46.20, 46.21, 48.0, 48.1, 48.3, 48.4, 48.5, 49.1, 51.3, 53, 55, 57.1, 57.2, 57.3, 59, 60, 62, 63, 64, 65 and PICMG 3.0R3, 3.1r2, AMC.4, Com.0, CompactPCI ExpressPlus, ICCC,  MicroTCA Rugged .0, MicroTCA Rugged.1 Air, MicroTCA Rugged .2 Conduction Cooled.
3/18/2009
3/19/2009
45
Updates to VITA 1, IEEE 1014, OBSAI RP3_V4.1, OBSAI Compliance RP3V4, StatEye
3/20/2009

46
Addition of SFP Multi-Source-Agreement, INF-8053 GBIC,
5/26/2009

47
Updates to PICMG 3.1r2, 2.30, 2.31,AMC.1, AMC.4, ARTM,  IRTM, ATCA Extensions, COM0R2, COM-X, MicroTCA.1/.2/.3, xTCA Software, xTCA Physics, xTCA Timing and updates to  VITA 42.0, 42.4, 42.5, 42.6, 42.10 , 46.3, 46.4, 46.6, 46.7, 46.9, 46.10, 46.12, 46.14, 46.20, 46.21, 47, 49, 49.1, 57.1-2008, 57.1-2009, 58.0, 58.1,59, 61, 62, 63, 64, 65, 66.0, 66.1, 67, 68, 69, and 70.
12/15/2009
12/15/2009
48
Updates to VITA 48.0, 48.1 and 48.2 also OIF SFI-4, OIF SFI-5, OIF SPI-3, OIF SPI-4.1 OIF SPI-4.2, OIF SPI-5, and a corrected URL for the OIF
12/18/2009
12/19/2009
49
Corrected color guidelines Updates to PICMG 1.0, 1.2, 1.2 and 1.3
12/27/2009
12/27/2009
50
Updated PXI-1, PXI-1 ECN, PXI-5, PXI-5 ECN, Added PICMG IRTM, ARTM and VITA 46.9, and  65
1/7/2010
1/8/2010





All registered trade marks are the property of their respective owners. CompactPCI and AdvancedTCA are trademarks of PICMG. This list is not complete and may contain errors. It is provided as is. Do not claim conformance to draft standards. This document is distributed under the GNU Free Documentation License.

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